SAKI 3D ooi umatshini 3Di MS2

I-SAKI 3Di MS2 yinkqubo ephezulu ye-3D yokuhlola okuzenzekelayo (i-AOI) izixhobo ezenzelwe i-SMT (i-teknoloji ye-surface mount) imigca yokuvelisa kwaye isetyenziselwa ukuhlolwa komgangatho ophezulu we-soldering ngexesha le-PCB (ibhodi yesekethe eprintiweyo).

2. Iinkcukacha eziphambili zobugcisa

1. Iinkcukacha ze-Hardware

IiNkcazo zeProjekthi

Indlela yokubona i-3D ye-imaging yee-angle ezininzi + i-AI yokubona ngobukrelekrele

Ubungakanani obukhulu bePCB 510mm × 460mm (ubungakanani obukhulu bungenziwa ngokwezifiso)

Ubuncinci bokubona into 01005 (0.4mm × 0.2mm)

Isisombululo se-Z-axis ≤1μm

Isantya sokubona Ubuninzi beebhodi/iyure eziyi-1,500 (kuxhomekeke kubunzima bePCB)

Inkqubo yomthombo wokukhanya Umthombo wokukhanya onemibala emininzi ye-LED, ulawulo olucwangcisiweyo

Inkqubo yekhamera Ikhamera yeCCD enesisombululo esiphezulu, ukudubula kwee-angle ezininzi

Ubude bokulinganisa ububanzi 0-10mm

Ukuchaneka komlinganiselo wobude ± 5μm

2. Iinkcukacha zeSoftware

IiNkcazo zeProjekthi

Inkqubo esebenzayo Windows 10/11 (64-bit)

Ukufunyanwa kwe-algorithm ye-AI nzulu yokufunda + ukusetyenzwa kwemifanekiso yemveli

Inkqubo yokucwangcisa ujongano lomzobo, inkxaso yokungenisa idatha yeCAD

Idatha ye-CSV, i-XML, i-IPC-CFX (inkxaso ye-MES docking)

Iprothokholi yonxibelelwano SECS/GEM, TCP/IP

3. Iinzuzo eziphambili

1. Ukubonwa kwe-3D echanekileyo ephezulu kakhulu

Yamkela i-Multi-angle ye-3D imaging, umlinganiselo ochanekileyo weeparamitha eziphambili ezifana nokuphakama kwe-solder paste, i-component offset, i-coplanarity, njl.

Iyakwazi ukubona i-01005 i-ultra-small components, ihambelana neemfuno zokubona iibhodi ze-PCB eziphezulu.

2. I-algorithm ehlakaniphile ye-AI inciphisa izinga lobuxoki

I-algorithm yokufunda eyakhelwe-ngaphakathi, funda ngokuzenzekelayo iimpawu ze-welding eziqhelekileyo, ukunciphisa iifowuni zobuxoki.

Ukuxhasa ukulungelelaniswa kweparameter ukulungelelanisa iinkqubo ezahlukeneyo zokuvelisa.

3. Ukufumanisa isantya esiphezulu, ukuphucula ukusebenza kakuhle kwemveliso

Isantya sokubona sifikelela kwiibhodi ze-1,500 / iyure ukuhlangabezana neemfuno eziphezulu zemveliso.

Ukulungiswa kwekhompuyutha ehambelanayo, nciphisa ixesha lokucubungula idatha.

4. Ukulungelelaniswa okuguquguqukayo kwiimfuno ezahlukeneyo zemveliso

Inokwandisa ubumbeko beekhamera ezininzi ukuqhelanisa neesayizi ezahlukeneyo zePCB kunye neemfuno zokubona.

Inkxaso yeprogram engaxhunyiwe kwi-intanethi (OLP) ukunciphisa ixesha lokunciphisa umgca wemveliso.

5. Umsebenzisi-friendly kwaye kulula ukusebenza

Ujongano lwenkqubo yomzobo, yehlisa umda wokusebenza.

Ukucofa-kanye ukulinganisa, ukwenza lula ukugcinwa kwezixhobo.

IV. Amanyathelo okhuseleko okusebenza

1. Ukuvula kunye nokuqalisa

✅ Ukusebenza okuchanekileyo:

Qinisekisa ukuba isixhobo sibekwe ngokuthe tye ukunqanda ukungcangcazela okuchaphazela ukuchaneka kokubhaqwa.

Ngaphambi kokukhanyisa, jonga ukuba umbane, umthombo womoya, kunye nentambo yedatha ziqhagamshelwe ngokuqhelekileyo.

Emva kokugqiba inkqubo yokuzivavanya, yenza ulungelelwaniso lwereferensi (kucetyiswa kanye ngeveki).

2. Izicwangciso zokufumanisa iPCB

✅ Ukusebenza okuchanekileyo:

Qinisekisa ukuba ibhodi yePCB icocekile kwaye ayinathuli ukunqanda ukugwetywa.

Lungisa ububanzi bomzila ukuze utshatise ubungakanani bePCB.

Khetha inkqubo yobhaqo echanekileyo ukunqanda iimpazamo zeparameter.

3. Ukusebenza ngokukhuselekileyo

Musa ukuvula ikhava yokukhusela ngexesha lokusebenza ukuphepha umonakalo womatshini.

Cofa iqhosha lokumisa likaxakeka (E-Stop) ngexesha likaxakeka.

Jonga rhoqo ukuba inzwa yokhuseleko isebenza ngokufanelekileyo.

5. Ulwazi lwempazamo eqhelekileyo kunye nezisombululo

Impazamo enokwenzeka Unobangela Isisombululo

Umfanekiso omfiliba/ongekhoyo Ungcoliseko lweLens, umthombo wokukhanya ongaqhelekanga Coca ilens, khangela ukuqaqamba komthombo wokukhanya

PCB ibhodi transmission ikhadi Track impazamo yomiselo ububanzi, ibhanti ekhululekileyo Lungisa umzila, khangela utsalo ibhanti

Ukonyuka kwezinga le-alam yobuxoki Iiparamitha zokubona azenziwanga, uphazamiseko lokukhanya kwendawo Lungisa kwakhona, lungisa iiparamitha zokubona

Ukonakala kweSoftware Ukonakala kwefayile yenkqubo, inkumbulo enganelanga Qala kwakhona inkqubo, qhagamshelana nenkxaso yobugcisa

Unxibelelwano olungaqhelekanga Ukusilela koqhagamshelwano lwenethiwekhi, ukungahambelani kweprotocol Jonga intambo yenethiwekhi, qinisekisa useto lwe-MES

6. Indlela yokugcina

1. Ulondolozo lwemihla ngemihla

Yonke imihla:

Coca umphezulu wesixhobo kunye nomkhondo wothumelo.

Jonga ukuba isekethe yomoya kunye nonikezelo lwamandla luqhelekileyo.

Rhoqo ngeveki:

Coca i-lens ebonakalayo (sebenzisa ilaphu elingenathuli + ulwelo olukhethekileyo lokucoca).

Jonga ukuqina kwebhanti.

2. Ukugcinwa rhoqo

Ngenyanga:

Gcina inkqubo yobhaqo kunye nedatha.

Lungiselela umthombo wokukhanya kunye nenkqubo yekhamera.

Ngekota:

Tshintsha iindawo zokunxiba (ezifana neebhanti, izihluzi).

Khangela ukuba ulwakhiwo lomatshini lukhululekile.

3. Ulondolozo lonyaka lobungcali

Kucetyiswa ukuba iinjineli eziqinisekisiweyo ze-SAKI zenze:

Ulungelelwaniso oluchanekileyo lwenkqubo ye-Optical.

Ukuhlolwa kokuchaneka kwesakhiwo soomatshini.

Ukuqukumbela

I-SAKI 3Di MS2 iye yaba sisixhobo esibalulekileyo sokulawula umgangatho kwimigca yemveliso ye-SMT yangoku kunye nobhaqo oluchanekileyo lwe-3D + ye-algorithm ekrelekrele ye-AI. Ngokusebenza okusemgangathweni + ukugcinwa rhoqo, ukusebenza kwezixhobo kunokwandiswa, ukugwetywa kakubi kunokuncitshiswa, kunye nokusebenza kakuhle kwemveliso kunokuphuculwa. Kucetyiswa ukuba abasebenzisi baseke inkqubo epheleleyo yolawulo lwezixhobo kunye nokugcina unxibelelwano kunye nenkxaso yobugcisa be-SAKI ukuqinisekisa ukusebenza okuzinzileyo kwexesha elide.