SAKI smt 2d ooi umatshini BF-TristarⅡ

I-SAKI BF-TristarⅡ sisizukulwana esitsha se-2D yenkqubo yokuhlola okuzenzekelayo (AOI) esungulwe ngu-SAKI, eyilelwe ukuhlolwa kwendibano yePCB echanekileyo. Isixhobo samkela i-architecture yenkqubo yeekhamera ezintathu kwaye idibanisa iteknoloji yokukhanyisa i-multi-spectral ukuphumeza ukuhlolwa okujikelezayo kwamacandelo e-SMT, ukuphucula kakhulu ukuchaneka kokuhlolwa kunye nokusebenza kakuhle.

2. Umgaqo wokusebenza

2.1 Inkqubo yokujonga umfanekiso

Amaqela amathathu eekhamera zeCCD ezigqwesileyo eziphakamileyo zisetyenziselwa ukuthwebula ngaxeshanye imifanekiso kwii-angles ezahlukeneyo (ngokuqhelekileyo i-0 °, 30 °, kunye ne-60 °)

Ikhamera nganye ixhotyiswe ngenkqubo yomthombo wokukhanya olungelelanisiweyo we-LED enokudibanisa amaza amaninzi (ukukhanya okubomvu, ukukhanya okuluhlaza, ukukhanya okumhlophe, njl.

Ukuphelisa ukubonwa kweendawo ezingaboniyo ngokusebenzisa i-imaging yee-angle ezininzi kunye nokuphucula ukuthembeka kokubona izinto ezinzima (BGA, QFN, njl.)

2.2 Ukuqukuqela kokwenziwa komfanekiso

Ukufunyanwa komfanekiso: iikhamera ezintathu zokudubula okuhambelanayo

Ukulungiswa komfanekiso: ibhalansi emhlophe ezenzekelayo, ukulungiswa kwesithunzi, ukuphelisa ingxolo

Ukutsalwa kophawu: ukubonwa komphetho, uhlalutyo lwegreyscale, ukuhambelana kwepateni

Ukuzimisela kwesiphene: ulwahlulo olukrelekrele olusekwe kwimithetho kunye ne-AI algorithms

Isiphumo sesiphumo: uphawu lwe-NG, ukulayishwa kwedatha kwi-MES

3. Iinkcukacha zobugcisa

IiParamitha zeProjekthi

Ukufumanisa ukuchaneka Ubuncinci becandelo elibonakalayo 0201, ukuchaneka kokufunyanwa kwe-solder ± 15μm

Isantya sokubona Ubuninzi bemizuzwana eyi-0.05/indawo yokubona (ixabiso lethiyori)

Ubungakanani bePCB Ubuninzi 510×460mm (uhlobo oluqhelekileyo)

Inkqubo yekhamera 3 × 5 megapixel CCD, izinga isakhelo 30fps

Inkqubo yomthombo wokukhanya Imibala emininzi ye-LED edityanisiweyo yomthombo wokukhanya (obomvu/bhlowu/omhlophe/IR)

Phinda ukuchaneka ± 5μm

Unxibelelwano lonxibelelwano lwe-SECS/GEM, TCP/IP, RS-232

4. Iimpawu eziphambili

4.1 Ukubhaqwa kwentsebenziswano yeekhamera ezintathu

Ikhamera ye-0 °: fumana icandelo lomzimba kunye nelogo

Ikhamera ye-30 °: fumana i-solder joint contour

Ikhamera ye-60 °: fumana i-solder joint surface status

Ukudityaniswa kwedatha okujonga-ntathu, ukuphelisa indawo engaboniyo yokubona enye

4.2 I-algorithm yokufumanisa ngobukrelekrele

Imodeli yokufunda nzulu: funda ngokuzenzekelayo iisampulu ze-OK/NG

Ulungelelwaniso lwe-Dynamic threshold: yenza ngokuzenzekelayo iiparamitha ngokotshintsho lwenkqubo

Umlinganiselo obonakalayo: bala iiparamitha ze-3D ezifana nobude becandelo kunye nomthamo ngokusebenzisa imifanekiso

4.3 Ukuziqhelanisa nemveliso esebenzayo

Uyilo lweengoma ezimbini: ubhaqo kunye neebhodi eziphezulu nezisezantsi ziqhutywa ngaxeshanye

Ukutshintsha komgca okhawulezayo: ixesha lokutshintsha inkqubo <30 imizuzwana

Ukuhlola kwakhona okukrelekrele: phawula ngokuzenzekelayo amanqaku akrokrisayo ukunciphisa ukuphinda kuhlolwe ngesandla

5. Imiqathango yokusetyenziswa

5.1 Iimfuno zokusingqongileyo

Ubushushu: 20±5℃

Ukufuma: 40-70%RH

Ukungcangcazela: <0.5G

Ukukhanyisa: Kuphephe ukukhanya okuthe ngqo okuqinileyo

5.2 Iinkcukacha zokusebenza

Inkqubo yokuvula amandla:

Zifudumeze imizuzu eyi-10

Yenza ulungelelwaniso oluzenzekelayo

Qinisekisa ukufana komthombo wokukhanya

Uhlolo lwemihla ngemihla:

Isampuli rhoqo kwiiyure ezi-2 ukuqinisekisa ukuzinza kohlolo

Coca rhoqo izikhonkwane zokubeka umthwali

Ulawulo lwenkqubo:

Kufuneka kusekwe ithala leencwadi elisemgangathweni ukulungiselela imifuziselo emitsha

Rhoqo gcina iiparamitha zeprogram

6. Iimpazamo eziqhelekileyo kunye nokuphatha

Ikhowudi yemposiso Inkcazo yempazamo

E101 Unxibelelwano lwekhamera luphelile 1. Jonga intambo yoqhagamshelwano lwekhamera

2. Qala kwakhona amandla ekhamera

E205 Umthombo wokukhanya ongaqhelekanga 1. Jonga unikezelo lwamandla okuqhuba i-LED

2. Faka endaweni yemodyuli ye-LED engalunganga

E307 Imposiso yokulawula intshukumo 1. Jonga i-servo drive

2. Coca isiporo sesikhokelo

I-E412 Ixesha lokugqitywa kokwenziwa komfanekiso 1. Lungiselela iiparamitha zokuhlola

2. Phucula inguqulelo yesoftware

E503 Uphazamiseko lonxibelelwano lwedatha 1. Jonga uqhagamshelwano lwenethiwekhi

2. Qala kwakhona inkonzo yonxibelelwano

7. Indlela yokugcina

7.1 Ulondolozo lwemihla ngemihla

Yonke imihla:

Coca ifestile yamehlo (sebenzisa ikhithi yokucoca ekhethekileyo)

Jonga uxinzelelo lomthombo womoya (ukuba kufanelekile)

Qinisekisa ukutsalwa kwebhanti lokuhambisa

Rhoqo ngeveki:

Lungiselela ubungakanani bomthombo wokukhanya

Coca isikhokelo somgca

Gcina imilinganiselo yenkqubo

7.2 Ukugcinwa rhoqo

Ngenyanga:

Faka endaweni yokucoca umqhaphu

Jonga ugxininiso lwekhamera

Lubricate amalungu oomatshini

Ngekota:

Ukulinganisa okunzulu kwenkqubo yamehlo

Faka endaweni yemodyuli endala ye-LED

Qwalasela ukugqunywa kwenkqubo yombane

7.3 Ulondolozo lonyaka

Kwenziwe ziinjineli zabenzi:

Ulungelelwaniso olupheleleyo lwenkqubo yamehlo

Ukuchongwa kokuchaneka kobume bomatshini

Uphuculo lwe-firmware yenkqubo yokulawula

8. Isishwankathelo seenzuzo zobugcisa

Ukukwazi ukubona: Inkqubo yeekhamera ezintathu ibona ukubonwa kwe-zero-dead-angle

Ukuchaneka kokufumanisa: I-algorithm yohlalutyo lwe-Pixel

Ukuchongwa ngokufanelekileyo: Uyilo lwenkqubo oluhambelanayo luphucula i-throughput

Ukuguquguquka: I-algorithm yobukrelekrele iqhelanisa nenkqubo yokuguquguquka

Scalability: Ixhasa uqhagamshelo lwe-intanethi kunye nenkqubo yokufumanisa i-3D

9. Iingcebiso zesicelo

Ibhodi yoxinaniso oluphezulu: Kucetyiswa ukuba isetyenziswe neSPI

Ibhodi eguquguqukayo: Kufuneka umthwali okhethekileyo

Iimoto ze-elektroniki: Kucetyiswa ukuba kuphuculwe imigangatho yovavanyo

Ii-elektroniki zabathengi: Isantya sovavanyo sinokulungiswa