ເຄື່ອງ SAKI smt 2d aoi BF-Tristar II

SAKI BF-TristarⅡ is a new generation of 2D automatic optical inspection system (AOI) launched by SAKI, designed for high-precision PCB assembly inspection. The equipment adopts a three-camera system architecture and combines multi-spectral lighting technology to achieve all-round inspection of SMT components, greatly improving inspection accuracy and efficiency.

2. ຫຼັກການເຮັດວຽກ

2.1 Optical imaging system

Three groups of high-resolution CCD cameras are used to simultaneously capture images from different angles (usually 0°, 30°, and 60°)

Each camera is equipped with an independent adjustable LED light source system that can combine multiple wavelengths (red light, blue light, white light, etc.)

Eliminate detection blind spots through multi-angle imaging and improve the detection reliability of complex components (BGA, QFN, etc.)

2.2 Image processing flow

Image acquisition: three cameras synchronous shooting

Image preprocessing: automatic white balance, shadow correction, noise elimination

Feature extraction: edge detection, grayscale analysis, pattern matching

Defect determination: intelligent classification based on rules and AI algorithms

Result output: NG mark, data upload to MES

3. Technical specifications

Project Parameters

Detection accuracy Minimum detectable component 0201, solder joint detection accuracy ±15μm

Detection speed Maximum 0.05 seconds/detection point (theoretical value)

PCB size Maximum 510×460mm (standard type)

Camera system 3×5 megapixel CCD, frame rate 30fps

Light source system Multi-color LED combination light source (red/blue/white/IR)

Repeat accuracy ±5μm

Communication interface SECS/GEM, TCP/IP, RS-232

4. Core features

4.1 Three-camera collaborative detection

0° camera: detect component body and logo

30° camera: detect solder joint contour

60° camera: detect solder joint surface status

Three-view data fusion, eliminating single-view detection blind spot

4.2 Intelligent detection algorithm

Deep learning model: automatically learn OK/NG sample features

Dynamic threshold adjustment: automatically optimize parameters according to process changes

Virtual measurement: calculate 3D parameters such as component height and volume through images

4.3 Efficient production adaptation

Dual track design: detection and upper and lower boards are carried out simultaneously

Quick line change: program switching time <30 seconds

Intelligent re-inspection: automatically mark suspicious points to reduce manual re-inspection

5. Precautions for use

5.1 ຄວາມຕ້ອງການດ້ານສິ່ງແວດລ້ອມ

Temperature: 20±5℃

Humidity: 40-70%RH

Vibration: <0.5G

Lighting: Avoid direct strong light

5.2 Operation specifications

ຂະບວນການເປີດເຄື່ອງ:

Warm up for 10 minutes

ປະຕິບັດການປັບອັດຕະໂນມັດ

Confirm the uniformity of the light source

Daily inspection:

Sampling every 2 hours to verify the inspection stability

Regularly clean the carrier positioning pins

Program management:

A standard inspection library must be established for new models

Regularly back up program parameters

6. ຄວາມຜິດພາດທົ່ວໄປແລະການຈັດການ

ລະຫັດຂໍ້ຜິດພາດ ການແກ້ໄຂຄໍາອະທິບາຍຄວາມຜິດພາດ

E101 Camera communication timeout 1. Check the camera connection cable

2. Restart the camera power

E205 Light source abnormality 1. Check the LED drive power supply

2. Replace the faulty LED module

E307 Motion control error 1. Check the servo drive

2. Clean the guide rail

E412 Image processing timeout 1. Optimize the inspection parameters

2. Upgrade the software version

E503 Data communication interruption 1. Check network connection

2. Restart communication service

7. ວິທີການບໍາລຸງຮັກສາ

7.1 ການດູແລປະຈໍາວັນ

ປະຈໍາວັນ:

Clean optical window (use special cleaning kit)

Check air source pressure (if applicable)

Confirm conveyor belt tension

ອາທິດ:

Calibrate light source intensity

Clean linear guide

ສຳຮອງຕົວກໍານົດການລະບົບ

7.2 ການບໍາລຸງຮັກສາເປັນປົກກະຕິ

ປະຈໍາເດືອນ:

Replace filter cotton

Check camera focus

Lubricate mechanical parts

ປະຈໍາໄຕມາດ:

Deep calibration of optical system

Replace aged LED module

Check electrical system insulation

7.3 ການບໍາລຸງຮັກສາປະຈໍາປີ

Performed by manufacturer engineers:

Full calibration of optical system

Mechanical structure accuracy detection

ຄວບຄຸມການຍົກລະດັບເຟີມແວຂອງລະບົບ

8. Summary of technical advantages

Detection capability: Three-camera system realizes zero-dead-angle detection

Detection accuracy: Sub-pixel analysis algorithm

Detection efficiency: Parallel processing architecture improves throughput

Adaptability: Intelligent algorithm adapts to process fluctuations

Scalability: Supports online connection with 3D detection system

9. ຄໍາແນະນໍາກ່ຽວກັບຄໍາຮ້ອງສະຫມັກ

High-density board: It is recommended to use with SPI

Flexible board: A special carrier is required

Automotive electronics: It is recommended to improve the testing standards

Consumer electronics: The testing speed can be optimized