en
ori
alb
amh
ara
arm
aym
aze
bel
ben
bos
bul
bur
cs
dan
de
div
el
est
fil
fin
fra
gle
glg
grn
heb
hi
hkm
hrv
hu
ice
id
it
jp
kan
kin
kor
lao
lav
lit
ltz
lug
mao
may
mlt
nep
nl
nor
nya
orm
per
pl
pt
rom
ru
san
sk
som
spa
srp
swa
swe
tam
th
tr
ukr
urd
vie
wel
xho
Indima ephambili kunye nomsebenzi we-DEK 265 kukuprinta ngokuchanekileyo i-solder paste okanye ukulungisa iglue kwi-PCB. I-DEK 265 sisixhobo sokuprinta sebhetshi esichanekileyo esifanelekileyo kwizitishi zokushicilela kwinkqubo ye-SMT (i-surface mount technology). Umgangatho wayo wokushicilela ubukhulu becala umisela umgangatho uwonke we-SMT.
Iiparamitha zobugcisa kunye neendlela zokusebenza
Iiparamitha ezithile zobugcisa ze-DEK 265 ziquka:
Iimfuno zokubonelela ngombane: isigaba esisodwa, i-220 volts
Iimfuno zomthombo womoya: 85 ~ 95PSI
Iindlela zokusebenza ziquka:
Ukuvula amandla: Vula iswitshi yamandla kunye nokuyeka ukukhawuleza, umatshini uya kubuyela ngokuzenzekelayo kwi-zero kwaye uqale ukuqaliswa.
Cima amandla: Emva kokuba umsebenzi woshicilelo ugqityiwe, cofa iqhosha lokuvala kwaye uqinisekise ukukhawuleza kwenkqubo ukugqiba ukuvala.
Ubume bangaphakathi kunye nomgaqo wokusebenza
Ubume bangaphakathi be-DEK 265 bubandakanya ezi modyuli eziphambili zilandelayo:
I-PRINTHEAD MODULE: Inokunyuswa kwaye ithotywe ukuze igcinwe lula kunye nokusebenza.
PRINT CARRIAGE MODULE: Iqhuba iscraper ukuya ngasemva naphambili.
SQUEEGEE MODULE: yenza imisebenzi yoshicilelo lwe-solder.
IMODULI YEKHAMERA: isetyenziselwa ulungelelwaniso olubonakalayo kunye nokulungiswa
Ezi modyuli zisebenza kunye ukuqinisekisa ukuba i-solder paste okanye ukulungisa iglue inokuprintwa ngokuchanekileyo kwi-PCB
