SAKI BF-3Si-L2 3D SPI Machine | SMT Printing Inspection

The BF-3Si-L2 model designation should be verified against the machine label before assigning detailed technical specifications. Its supplied product title identifies it as a 3D solder paste inspection system, a type of equipment used to measure printed deposits before component placement.

Three-dimensional SPI evaluates paste geometry through measurements such as area, height and volume. These results provide process data that can help distinguish an uneven deposit from a deposit that has insufficient or excessive volume. Depending on the inspection system and programmed criteria, bridging and irregular paste shapes can also be assessed.

For a production engineer, the useful distinction between SPI and post-placement AOI is the inspection stage: SPI checks the printed paste before components are mounted. This allows print-related problems to be investigated earlier in the assembly process.

The exact BF-3Si-L2 optical resolution, supported board dimensions, lane arrangement and software interfaces have not been confirmed. SAKI’s specifications for other 3Si models should not be substituted for this model without confirmation. If printer feedback or line-level data exchange is required, check the installed communication interfaces and compatible software.

SAKI BF-3Si-L2 3D SPI Machine Specifications

Configuration note: Confirm the full model designation and original technical documentation before publishing numeric specifications or claiming compatibility with a particular printer.