mpm ekyuma ekikuba stencil edison ii ekikolwa

Ebirungi ebikulu n’ebintu ebikulu ebiri mu MPM printer Edison II ACT mulimu:

Obutuufu n’obutebenkevu obw’amaanyi: Ekyuma ekikuba ebitabo ekya MPM Edison II ACT kirina obutuufu bw’okukuba ebitabo obw’amaanyi ennyo, nga kiddibwamu ±15 microns (±0.0006 inches) @6σ ku kifo kyennyini eky’okukuba ebitabo ekya solder paste, ne Cpk ≥ 2.0*. Kino kikakasa nti okukuba ebitabo kukwatagana era kwesigika

Obusobozi bw’okukola chip ennene: Printer esobola okukwata sayizi ya chip esinga obunene eya 450mmx350mm (17.72”x13.78”), esaanira circuit boards eza sayizi ez’enjawulo. Ku bipande ebinene okusinga 14”, waliwo ekintu ekiweereddwayo.

Sipiidi y’okukuba ebitabo ey’amangu: MPM Edison II ACT erina sipiidi esinga okukuba ebitabo eya mm 305/sec (12.0”/sec), ekiyinza okulongoosa ennyo enkola y’okufulumya.

Enkola ekyukakyuka ey’okuwagira ebikozesebwa: Printer ewagira enkola ez’enjawulo ez’okuwagira ebikozesebwa, omuli fixed top offset ne EdgeLoc edge support systems, ezisaanira ebikozesebwa eby’obuwanvu obw’enjawulo (0.2mm okutuuka ku 6.0mm)

Enkola ey’omulembe ey’okulaba ebifaananyi n’okussa essira: Printer erina kkamera emu eya digito n’enkola y’amaaso eyawuddwamu eriko patent, ekuwa ekifo ky’okulaba ekifaananyi ekya 9.0mmx6.0mm (0.354”x0.236”)

Okuyita waggulu n’okwesigamizibwa: Yazimbibwa ku nkola ya MPM ekulembedde mu makolero, MPM Edison II ACT erina okuyita mu ngeri eyeewuunyisa n’okwesigamizibwa ku nkola z’okukuba ebitabo ezisaba, ez’obungi obw’amaanyi

Tekinologiya omuyiiya: Printer ekozesa ekyuma ekikuba ebitabo eky’amaanyi ekya SpeedMaxTM, ekisobola okutuuka ku nsengekera y’okukuba ebitabo mu sikonda 6, okulongoosa ennyo enkola y’okufulumya. Ng’oggyeeko ekyo, eriko ebintu eby’omulembe nga ekyuma ekigaba solder paste eky’omulembe omupya, dual-box solder paste, Y-axis plate holder ne Gel-FlexTM base support system