Okunoonya amangu
AD8312 Plus positioning die bonder egatta ebirungi ebiri mu ultra-fast ne positioning
Enkola eno esobola okukwata enkola za chip eziwera n’enkola eziwera mu kyuma kimu
AD280 Plus die bonder erina obusobozi bwa high-precision die bonding, ekiyinza okukakasa nti ebitundu biteekebwa bulungi
Asobola okukwata ebibumbe ebitonotono (nga wansi nga 3 mil) ne substrates ennene (okutuuka ku mm 270 x 100), ebisaanira embeera ez’enjawulo ez’okukozesa.
Die bonder era erimu ebyuma ebirala ebiyamba, gamba nga ffaani n’ebyuma ebinyogoza
Geekvalue: Yazaalibwa ku byuma ebilonda n’okuteeka
Omukulembeze w'okugonjoola ensonga emu ku chip mounter
Ebitukwatako
Ng’omugabi w’ebyuma eri abakola ebyuma, Geekvalue ekuwa ebyuma ebipya n’ebikozesebwa n’ebikozesebwa okuva mu bika eby’amaanyi ku bbeeyi evuganya ennyo.
ekyamaguzi
SAKI AOI ekyuma kya smt Ebyuma bya semiconductor ekyuma kya pcb Ekyuma kya Label ebyuma ebiralaSMT layini eky'okugonjoola
© Eddembe lyonna liri mu buyinza bwaffe. Obuwagizi mu by'ekikugu:TiaoQingCMS
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