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AD8312 Plus positioning die bonder combines the advantages of ultra-fast and positioning
The system can handle multi-chip and multi-process applications in one machine
The AD280 Plus die bonder has high-precision die bonding capabilities, which can ensure the precise placement of components
Able to handle small molds (as low as 3 mil) and large substrates (up to 270 x 100 mm), suitable for a variety of application scenarios.
The die bonder is also equipped with other auxiliary equipment, such as fans and cooling devices
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As a supplier of equipment for the electronics manufacturing industry, Geekvalue offers a range of new and used machines and accessories from renowned brands at very competitive prices.
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