MRSI Systems Die Bonding Machine mrsi-705

MRSI-705 is a high-speed, convenient and flexible die-cement system‌, with main functions including dispensing, die-cement, eutectic welding, flip-chip welding and epoxy die-cement adhesive. It is suitable for product development, small to batch production, chassis mass production of lasers, devices, modulators, AOC, WDM/EML TO-Can, optical transceivers, LiDAR, VR/AR, sensors and optical imaging, providing "one-stop" "Solution‌

Advantages

‌‌‌‌With an accuracy of up to 5 microns and the ability to apply a keying force of up to 500N during keying, the MRSI-705 is suitable for advanced process packaging‌

‌Versatility‌: The system can handle multi-chip and multi-process applications in one machine, including automatic tip switching and laser welding, top and bottom heated eutectics, epoxy resin dipping and dispensing‌

‌Efficient production‌: The MRSI-705 is equipped with a "zero time" nozzle switching system, which greatly improves production efficiency‌

‌Stability‌: The system inherits the flexibility and stability of the MRSI-705 platform, with certified industry-leading stability, minimizing the machine's time‌

‌Wide application‌: Suitable for a variety of packaging needs, including wafer chip (CoW), carrier chip (CoC), PCB, TO and tube shell packaging‌

Application areas

MRSI-705 is widely used in lasers, inertial, modulators, AOC, WDM/EML R&D and production of TO-Can, optical transceivers, LiDAR, VR/AR, sensors and optical imaging products. Its power consumption and high efficiency make it an ideal vehicle-mounted tool in these fields.