IiNkqubo ze-MRSI Die Bonding Machine mrsi-705

I-MRSI-705 yinkqubo ye-die-cement ekhawulezayo, elula kwaye eguquguqukayo, enemisebenzi ephambili equka ukukhupha, i-die-cement, i-eutectic welding, i-flip-chip welding kunye ne-epoxy die-cement adhesive. Ilungele ukuphuhliswa kwemveliso, encinci ukuya kwi-batch yemveliso, i-chassis mass production of lasers, izixhobo, i-modulators, i-AOC, i-WDM / EML TO-Can, i-transceivers optical, i-LiDAR, i-VR / AR, i-sensor kunye ne-imaging optical, ukubonelela "i-one-stop " "Isisombululo

Iingenelo

Ngokuchaneka ukuya kuthi ga kwi-5 microns kunye nokukwazi ukusebenzisa amandla angundoqo ukuya kuthi ga kwi-500N ngexesha le-keying, i-MRSI-705 ifanelekile ukupakishwa kwenkqubo ephezulu.

I-Versatility: Inkqubo inokusingatha i-multi-chip kunye ne-multi-process applications kumatshini omnye, kubandakanywa ukutshintshela i-tip ngokuzenzekelayo kunye ne-laser welding, i-eutectics eshushu phezulu nasezantsi, i-epoxy resin dipping kunye nokusabalalisa.

Imveliso esebenzayo: I-MRSI-705 ixhotyiswe ngenkqubo yokutshintsha umbhobho "zero ixesha", ephucula kakhulu ukusebenza kakuhle kwemveliso.

Uzinzo: Inkqubo izuza ukuguquguquka kunye nokuzinza kweqonga le-MRSI-705, kunye nozinzo oluqinisekisiweyo olukhokelela kwishishini, ukunciphisa ixesha lomatshini.

Usetyenziso olubanzi: Ifanelekile kwiimfuno ezahlukeneyo zokupakisha, kubandakanywa i-wafer chip (CoW), i-carrier chip (CoC), i-PCB, i-TO kunye ne-tube shell packaging.

Iindawo zesicelo

I-MRSI-705 isetyenziswa ngokubanzi kwii-lasers, i-inertial, i-modulators, i-AOC, i-WDM / EML R & D kunye nokuveliswa kwe-TO-Can, i-transceivers optical, i-LiDAR, i-VR / AR, i-sensor kunye neemveliso ze-imaging optical. Ukusetyenziswa kwayo kwamandla kunye nokusebenza okuphezulu kuyenza ibe sisixhobo esifanelekileyo sokuxhonywa kwisithuthi kule mimandla.