Ukukhangela ngokukhawuleza
I-AD8312 Plus yokubeka i-die bonder idibanisa iingenelo ze-ultra-fast kunye nokubeka
Inkqubo inokusingatha iinkqubo ezininzi ze-chip kunye neenkqubo ezininzi kumatshini omnye
I-AD280 Plus die bonder ine-high-chane-chane ye-die bonding, enokuqinisekisa ukubekwa okuchanekileyo kwamacandelo.
Iyakwazi ukuphatha iimbumba ezincinci (eziphantsi kwe-3 mil) kunye ne-substrates enkulu (ukuya kwi-270 x 100 mm), ifanelekile kwiimeko ezahlukeneyo zesicelo.
I-die bonder nayo ixhotyiswe kunye nezinye izixhobo ezincedisayo, ezifana nabalandeli kunye nezixhobo zokupholisa
I-Geekvalue: Uzalelwe oomatshini bokuKhetha-neNdawo
Inkokeli yesisombululo esinye sokumisa i-chip mounter
Ngathi
Njengomthengisi wezixhobo kushishino lokwenziwa kombane, iGeekvalue ibonelela ngoluhlu loomatshini abatsha nabasele besetyenzisiwe kunye nezixhobo ezisuka kwiibrendi ezaziwayo ngamaxabiso akhuphisana kakhulu.
imveliso
SAKI AOI umatshini wesmt Izixhobo zeSemiconductor umatshini wepcb Umatshini wokulebula ezinye izixhoboIsisombululo somgca we-SMT
© Onke Amalungelo Agciniwe. Inkxaso yobuGcisa:TiaoQingCMS
en
ori
alb
amh
ara
arm
aym
aze
bel
ben
bos
bul
bur
cs
dan
de
div
el
est
fil
fin
fra
gle
glg
grn
heb
hi
hkm
hrv
hu
ice
id
it
jp
kan
kin
kor
lao
lav
lit
ltz
lug
mao
may
mlt
nep
nl
nor
nya
orm
per
pl
pt
rom
ru
san
sk
som
spa
srp
swa
swe
tam
th
tr
ukr
urd
vie
wel
xho