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Iingenelo ze-ASM die bonder AD280 Plus zibandakanya isantya esiphezulu, ukusebenza kakuhle kunye nobuchwepheshe bokupakisha obuphambili. Izixhobo zifanelekile ukupakishwa kwe-IC, ngokukodwa kwintsimi yokupakisha okuphambili, kwaye inokuhlangabezana neemfuno ze-high-precision die bonding.
Iingenelo ezithile : I-AD280 Plus die bonder ine-high-precision die bonding capabilities, enokuqinisekisa ukubekwa okuchanekileyo kwamacandelo, ukunciphisa i-workpieces, kunye nokwandisa umthamo wemveliso.
Ukusebenza okuphezulu: Isixhobo sisebenza kakuhle kwinkqubo yokuvelisa, inokuphucula kakhulu ukusebenza kwemveliso, ukunciphisa imijikelezo yokuvelisa, kunye nokunciphisa iindleko zokuvelisa. Itekhnoloji yokupakisha ekwinqanaba eliphezulu: Isebenza kwitekhnoloji yokupakisha ephezulu, inokuhlangabezana neemfuno zezixhobo ze-elektroniki zanamhlanje zokusebenza okuphezulu kunye nokuthembeka okuphezulu.
Ububanzi kunye neendawo zokusetyenziswa kwe-AD280 Plus die bonder ilungele ukupakishwa kwe-IC, ngakumbi kwintsimi yokupakisha ephezulu, kwaye ivavanywa ngokubanzi kwintsimi yokwenziwa kwezixhobo zombane ezahlukeneyo. Isikhundla sayo kunye nokusebenza kakuhle kusetyenziswa ngokubanzi kwimveliso ye-semiconductor, ukupakishwa kwesekethe edibeneyo kunye nezinye iinkalo.
