ASM LED packaging machine IDEALab 3G

The main functions and roles of the ASM IC packaging machine IDEALab 3G include the following aspects:

‌High-density solution‌: IDEALab 3G is suitable for the research and development and trial production of dedicated single-beer molding systems, providing high-density packaging solutions with a size of 100mm wide x 300mm long‌.

‌Single-beer configuration‌: The equipment provides two optional configurations of 120T and 170T, suitable for different production needs‌.

‌SECS GEM function‌: IDEALab 3G has SECS GEM function, which improves the automation and integration of the production process‌.

‌Advanced packaging technology‌: The equipment supports a variety of advanced packaging technologies, such as UHD QFP, PBGA, PoP and FCBGA, etc., suitable for various packaging needs‌.

‌Expandable modules‌: IDEALab 3G supports a variety of expandable modules, such as FAM, electric wedge, SmartVac and SmartVac, etc., which further enhances the flexibility and functionality of the equipment‌.

‌Application and importance of ASM IC packaging machine in semiconductor packaging‌:

‌Chip placement‌: The chip placement machine is one of the most critical equipment in the semiconductor packaging process. It is mainly responsible for grabbing chips from the wafer and placing them on the substrate, and bonding the chips to the substrate with silver glue. The accuracy, speed, yield and stability of the chip placement machine are crucial to the advanced packaging process‌.

‌Advanced packaging technology‌: With the development of semiconductor technology, advanced packaging technologies such as 2D, 2.5D, and 3D packaging have gradually become mainstream. These technologies achieve higher integration and performance by stacking chips or wafers, and equipment such as IDEALab 3G plays an important role in the application of these technologies‌.

‌Market Trend‌: With the continuous advancement of semiconductor technology, the demand for advanced packaging equipment is also increasing. High-density and high-performance packaging equipment such as IDEALab 3G have broad application prospects in the market‌

‌The advantages of ASM IC packaging machine IDEALab 3G mainly include the following aspects‌: ‌High-density solution‌: IDEALab 3G provides a high-density packaging solution with a size of 100mm wide x 300mm long, which can meet the needs of high-density packaging‌. ‌Versatility‌: The equipment supports a variety of configurations, including 120T and 170T single-beer machine configurations, suitable for different production needs‌. ‌Advanced technical features‌: IDEALab 3G has SECS GEM function, supports automated and intelligent production processes, and improves production efficiency and flexibility‌