yamaha yg200 smt pick and place machine

The working principle of Yamaha SMT machine YG200 mainly includes three links: SMT, positioning and welding. During the SMT process, the SMT machine grabs the components from the material box through intelligent sensing devices, and then detects the components through the visual system to ensure that they are accurately placed on the SMT device. The positioning link adjusts the components through high-precision mechanical arms and optical systems to ensure that there will be no deviation during the welding process. The last step is welding. The SMT machine uses high-temperature soldering iron welding technology to ensure the quality and reliability of welding through appropriate temperature and welding time. ‌

Technical parameters

The technical parameters of the YG200 SMT machine include:

Substrate size: maximum L330×W250mm, minimum L50×W50mm

Substrate thickness/weight: 0.4～3.0mm/less than 0.65kg

Placement accuracy: absolute accuracy ±0.05mm/CHIP, ±0.05mm/QFP, repeatability ±0.03mm/CHIP, ±0.03mm/QFP

Placement speed: 0.08 seconds/CHIP under optimal conditions

Power supply specifications: three-phase AC 200/208/220/240/380/400/416V ±10%, 50/60Hz,

The working principle of the Yamaha SMT machine YG200 mainly includes three links: SMT, positioning and welding. During the patch process, the patch machine grabs the components from the material box through intelligent sensing devices, and then detects the components through the visual system to ensure that they are accurately placed on the patch device ‌1. The positioning link adjusts the components through high-precision mechanical arms and optical systems to ensure that they will not deviate during the welding process ‌1. The last step is welding. The patch machine uses high-temperature soldering iron welding technology to ensure the quality and reliability of welding through appropriate temperature and welding time. Yamaha SMT YG200 is an ultra-high-speed, high-precision, high-performance patch machine. The following are its detailed technical parameters and functional features:

Technical parameters

‌Placement speed‌: The placement speed is 0.08 seconds/CHIP under optimal conditions, and the placement speed can reach up to 34800CPH‌.

‌Placement accuracy‌: Absolute accuracy ±0.05mm/CHIP, repeatability accuracy ±0.03mm/CHIP‌.

‌Substrate size‌: Supports substrate sizes from L330×W250mm to L50×W50mm‌.

‌Power supply specification‌: three-phase AC 200/208/220/240/380/400/416V±10%, power capacity 7.4kVA‌.

‌Dimensions‌: L1950×W1408×H1850mm, weight about 2080kg‌.

Features

‌High precision, high speed‌: YG200 can achieve ultra-high-speed placement under the best conditions, with a placement speed of 0.08 seconds/CHIP and a placement speed of up to 34800CPH‌.

‌High precision‌: The placement accuracy throughout the process can reach ±50 microns, and the repeatability accuracy throughout the process can reach ±30 microns‌.

‌Multi-function‌: Supports placement from 0201 micro components to 14mm components, using 4 high-resolution multi-vision digital cameras‌.

‌Efficient production‌: The optional YAMAHA patented flying nozzle changer can effectively reduce the machine's idling loss and is suitable for ultra-high-speed production‌.

Application scenarios

YG200 is suitable for various electronic manufacturing scenarios, especially for the production of electronic products that require high-precision and high-speed mounting. Its high efficiency and stability make it an ideal choice for modern electronic manufacturing.