yamaha s20 smt placement machine

The main advantages of the Yamaha S20 SMT machine include the following:

‌3D mixed placement capability‌: The S20 uses a newly developed dispensing head that is interchangeable with the placement head, which realizes the interactive implementation of solder paste dispensing and component placement, and supports 3D mixed placement. This enables the equipment to handle three-dimensional substrates such as concave and convex surfaces, inclined surfaces, and curved surfaces, and promote 3D MID (Mid-Level Integration) production ‌

‌High-precision placement‌: The S20 has very high placement accuracy, with a chip (CHIP) placement accuracy of ±0.025mm (3σ) and an integrated circuit (IC) placement accuracy of ±0.025mm (3σ), ensuring a high-precision placement effect ‌

‌Powerful substrate handling capabilities‌: The S20 supports substrates of various sizes, with a minimum size of 50mm x 30mm and a maximum size of up to 1,830mm x 510mm (standard is 1,455mm). This enables it to adapt to various production needs. ‌

‌Flexible component handling capabilities‌: The S20 can handle a variety of components from 0201 to 120x90mm, including BGA, CSP, connectors and other special parts to meet diverse production needs. ‌

‌Efficient production capacity‌: The S20 can achieve a placement speed of 45,000 components per hour under optimal conditions, greatly improving production efficiency. ‌

‌Strong versatility and interchangeability‌: The S20's new material change trolley, which can be installed with 45 feeder tracks, can be mixed with existing material change trolleys, enhancing the versatility and interchangeability of the equipment. ‌