mpm stencil printer edison ii act

The main advantages and features of the MPM printer Edison II ACT include:

‌High precision and stability‌: The MPM Edison II ACT printer has extremely high printing accuracy, with a repeatability of ±15 microns (±0.0006 inches) @6σ for the actual solder paste printing position, and Cpk ≥ 2.0*. This ensures printing consistency and reliability‌

‌Large chip processing capability‌: The printer can handle a maximum chip size of 450mmx350mm (17.72”x13.78”), which is suitable for circuit boards of various sizes. For boards larger than 14”, a dedicated fixture is available. ‌

‌Fast printing speed‌: The MPM Edison II ACT has a maximum printing speed of 305mm/sec (12.0”/sec), which can significantly improve production efficiency. ‌

‌Flexible workpiece support system‌: The printer supports a variety of workpiece support methods, including fixed top offset and EdgeLoc edge support systems, suitable for workpieces of different thicknesses (0.2mm to 6.0mm) ‌

Advanced image field of view and focusing system: The printer is equipped with a single digital camera and a patented split optical system, providing an image field of view of 9.0mmx6.0mm (0.354”x0.236”) ‌

‌High throughput and reliability‌: Built on the industry-leading MPM platform, the MPM Edison II ACT has amazing throughput and reliability for demanding, high-volume printing applications ‌

‌Innovative technology‌: The printer uses the SpeedMax™ high-speed printer, which can achieve a 6-second printing cycle, greatly improving production efficiency. In addition, it is equipped with advanced features such as the new generation dual-box solder paste dispenser, Y-axis plate holder and Gel-Flex™ base support system‌