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TCM-X300 has high-speed placement capability, which can quickly and accurately complete the placement of various components and improve production efficiency.
Hitachi TCM-X200 is a high-speed placement machine with high automation and high placement accuracy.
Philips iFlex T2 is an innovative, intelligent and flexible surface mount technology (SMT) solution launched by Asbeon.
iFlex adheres to the most flexible "one machine for multiple uses" concept in the industry today
REHM Reflow Oven Vision TripleX is a three-in-one system solution launched by Rehm Thermal Systems GmbH,
The VisionXC reflow system is suitable for small and medium-sized batch production, laboratories or demonstration production lines
The VisionXP+ reflow soldering system is suitable for a variety of manufacturing environments,
Suitable for lead-free soldering, ensuring the stability and consistency of the soldering process
The FuzionOF chip mounter has a production speed of up to 16,500 cph
The vacuum suction nozzle on the SMT head takes the component at the picking position
Maximum substrate processing size is 635mm x 610mm, and maximum wafer size is 300mm (12 inches)
●TO-can packaging processing capability
About Us
As a supplier of equipment for the electronics manufacturing industry, Geekvalue offers a range of new and used machines and accessories from renowned brands at very competitive prices.
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