Ixesha lomjikelo woshicilelo yimizuzwana emi-5 (ngaphandle kwexesha lokushicilela), elilungele iimfuno zokuvelisa ngesantya esiphezulu.

Ukuchaneka koshicilelo lwe-SP2-C yomshicileli we-solder paste yi ±15um@6σ, kunye nokuchaneka okumanzi koshicilelo yi-±25um@6σ.

Umshicileli we-Hanwha SP1-W sishicileli sokuncamathisela se-solder esisebenza ngokugqibeleleyo, sisetyenziswa ikakhulu kushicilelo lwe-solder paste kwi-SMT.

Ubuninzi buyi-330mm x 250mm (itshaneli enye) / 330mm x 250mm (itshaneli ezimbini, uyazikhethela)

I-DEK TQL ilungele iimeko ezifuna ukuchaneka okuphezulu kunye nobukhulu obukhulu bebhodi yesekethe yoshicilelo.

I-DEK 265 sisixhobo soshicilelo sebhetshi esichanekileyo esilungele izikhululo zoshicilelo kwi-SMT.

I-DEK GALAXY uNeo usebenzisa itekhnoloji yemoto ehambelanayo ukuqinisekisa isantya kunye nokuchaneka. Ifanelekile kwizicelo ezichanekileyo eziphezulu kwi-wafer, i-substrate kunye nenqanaba lebhodi

Umshicileli uxhotyiswe ngobubanzi bemanuwali kunye nezilungelelanisi zobunzulu besikrini, esenza ukuba indawo echanekileyo yestensile kunye neziphumo zoshicilelo ezichanekileyo.

Indlela yokulawula umbane yeDEK Horizon 02i iqinisekisa isantya esiphezulu kunye nokuchaneka.

Inkqubo yekhamera yedijithali yeCCD: ixhotyiswe ngokukhanya okufanayo komsesane kunye nokukhanya okuphezulu kokukhanya kwe-coaxial, inokulungelelanisa ukukhanya ngokungenasiphelo kwaye ilungele iintlobo ezahlukeneyo zeebhodi zePCB.

IMPM Edison II ACT umshicileli unokuchaneka okuphezulu kakhulu, ngokuphinda-phinda kwe-±15 microns (±0.0006 i-intshi) @6σ yeyona ndawo yoshicilelo lwe-solder.

Faka i-solder paste (ubungakanani be-solder paste eyongeziweyo okokuqala malunga ne-2/3 yeetoti ze-0.35kg ~ 1 itoti ye-0.5kg)