mpm umshicileli westencil edison ii act

Iingenelo eziphambili kunye neempawu zeMPM umshicileli we-Edison II UMTHETHO ziquka:

Ukuchaneka okuphezulu kunye nozinzo: Umshicileli weMPM Edison II ACT unokuchaneka okuphezulu kakhulu, kunye nokuphindaphinda kwe-±15 microns (±0.0006 intshi) @6σ yeyona ndawo yokushicilela i-solder paste, kunye neCpk ≥ 2.0*. Oku kuqinisekisa ukuhambelana koshicilelo kunye nokuthembeka

Ikhono elikhulu lokucubungula i-chip: Umshicileli unokusingatha ubukhulu be-chip ye-450mmx350mm (17.72"x13.78"), efanelekileyo kwiibhodi zeesekethe ezinobungakanani obahlukeneyo. Kwiibhodi ezinkulu kuno-14”, kukho into enikezelweyo.

Isantya sokushicilela ngokukhawuleza: I-MPM Edison II ACT inesantya esiphezulu sokushicilela i-305mm / sec (12.0"/sec), enokuphucula kakhulu ukusebenza kwemveliso.

Inkqubo yenkxaso ye-workpiece eguquguqukayo: Umshicileli uxhasa iindlela ezahlukeneyo zenkxaso ye-workpiece, kubandakanywa ne-fixed top offset kunye neenkqubo zenkxaso ze-EdgeLoc edge, ezilungele ii-workpieces ezinobunzima obahlukeneyo (0.2mm ukuya kwi-6.0mm)

Intsimi yomfanekiso ophucukileyo wokujonga kunye nenkqubo yokugxila: Umshicileli uxhotyiswe ngekhamera yedijithali enye kunye ne-patented optical optical system, ebonelela ngomfanekiso we-9.0mmx6.0mm (0.354"x0.236").

Ukuphumelela okuphezulu kunye nokuthembeka: Eyakhelwe kwi-platform ye-MPM ehamba phambili kwishishini, i-MPM Edison II UMTHETHO unomsebenzi omangalisayo kunye nokuthembeka kokufuna, izicelo zokushicilela eziphezulu.

Itekhnoloji entsha: Umshicileli usebenzisa i-SpeedMax™ umshicileli wesantya esiphezulu, onokufikelela kumjikelo wokuprinta wemizuzwana emi-6, uphucula kakhulu ukusebenza kakuhle kwemveliso. Ukongeza, ixhotyiswe ngeempawu eziphambili ezinje ngesizukulwana esitsha se-solder paste dispenser, i-Y-axis plate holder kunye ne-Gel-Flex ™ inkqubo yenkxaso.