SAKI 3D SPI machine 3Si LS2

I-SAKI 3D SPI 3Si LS2 yinkqubo yokuhlola i-solder paste ye-3D, isetyenziselwa ukuhlola umgangatho we-solder paste yokushicilela kwiibhodi zesekethe eziprintiweyo (PCBs).

Iimpawu eziphambili kunye neemeko zesicelo

I-SAKI 3Si LS2 inezi mpawu zilandelayo:

Ukuchaneka okuphezulu: Ixhasa izisombululo ezintathu ze-7μm, 12μm, kunye ne-18μm, ezifanelekileyo kwiimfuno zokuhlolwa kwe-solder paste ephezulu.

Inkxaso yefomathi enkulu: Ixhasa ubungakanani bebhodi yesekethe ukuya kuthi ga kwi-19.7 x 20.07 intshi (500 x 510 mm), ifanelekile kwiimeko ezahlukeneyo zesicelo.

Isisombululo se-Z-axis: I-Innovative Z-axis optical head control function ingakwazi ukubona amacandelo aphezulu, amacandelo anqabileyo kunye ne-PCBA kwi-fixtures, ukuqinisekisa ukuhlolwa ngokuchanekileyo kwamacandelo aphezulu.

Ukuhlolwa kwe-3D: Ixhasa iindlela ze-2D kunye ne-3D, kunye nomlinganiselo ophezulu wokulinganisa ubude ukuya kwi-40 mm, ifanelekile kumacandelo obunzima obunzima.

Iinkcukacha zobugcisa kunye neeparamitha zokusebenza

Iinkcukacha zobugcisa kunye neeparamitha zokusebenza ze-SAKI 3Si LS2 ziquka:

Isisombululo: 7μm, 12μm kunye ne-18μm

Ubungakanani bePCB: Ubuninzi 19.7 x 20.07 intshi (500 x 510 mm)

Ubuninzi bobude bomlinganiselo wobude: 40 mm

Isantya sokubona: 5700 square millimeters / yesibini

Ukuma kwemarike kunye novavanyo lomsebenzisi

I-SAKI 3Si LS2 ibekwe kwimarike njengenkqubo yokuhlola i-solder ye-3D echanekileyo ephezulu kwizicelo zoshishino ezifuna ukuhlolwa okuphezulu. Uvavanyo lomsebenzisi lubonisa ukuba inkqubo yenza kakuhle ngokuchaneka kokuhlolwa kunye nokusebenza kakuhle, okunokuphucula kakhulu ukusebenza kwemveliso kunye nomgangatho wemveliso.

Izinto eziluncedo ze-SAKI 3Si LS2 kumhlaba wokuhlolwa kwe-3D solder paste (SPI) zibonakaliswa ikakhulu kule miba ilandelayo:

Ukuchaneka okuphezulu kunye nokuphindaphinda: I-SAKI 3Si LS2 isebenzisa itekhnoloji yokulinganisa i-3D ephezulu, idityaniswe nemifanekiso ye-2D kunye nokuqinisekiswa kobude be-3D, ukuphumeza uhlolo oluchanekileyo kakhulu. Ukucwangciswa kwayo kwe-hardware kubandakanya i-loop evaliweyo, i-dual servo motor drive system, i-high-resolution linear scale, kunye nesakhiwo esiqinileyo se-gantry ukuqinisekisa ukuchaneka komlinganiselo kunye nokuphindaphinda.

Ikhono lokuhlola ifomati enkulu: Isixhobo sixhasa ukuhlolwa kwefomathi enkulu, kunye nobukhulu bebhodi yesekethe yobukhulu ukuya kwi-19.7 x 20.07 intshi (500 x 510 mm), kwaye ibonelela ngezigqibo ezintathu ze-7μm, 12μm, kunye ne-18μm, ezifanelekileyo kwiindidi ezahlukeneyo. yeemeko zesicelo.

Ukuhlanganiswa komgca wokuvelisa ngokufanelekileyo: I-SAKI 3Si LS2 inesisombululo se-M2M, esinokuqonda ngokugqibeleleyo umsebenzi wokulawula i-loop evaliweyo yesixhobo somgca wemveliso, ukondla emva kweziphumo zokuhlola kumshicileli we-front-end kunye nomshini wokubeka umva, kunye nangengqiqo. lungisa ushicilelo lwe-solder paste kunye nokubekwa kwecandelo, ngaloo ndlela kuphuculwe ukusebenza kakuhle kwemveliso kunye nomgangatho wendibano yonke.