Nje
enen oriori albalb amhamh araara armarm aymaym azeaze belbel benben bosbos bulbul burbur cscs dandan dede divdiv elel estest filfil finfin frafra glegle glgglg grngrn hebheb hihi hkmhkm hrvhrv huhu iceice idid itit jpjp kankan kinkin korkor laolao lavlav litlit ltzltz luglug maomao maymay mltmlt nepnep nlnl nornor nyanya ormorm perper plpl ptpt romrom ruru sansan sksk somsom spaspa srpsrp swaswa sweswe tamtam thth trtr ukrukr urdurd vievie welwel xhoxho
product
EKHAYA>imveliso > SAKI AOI >
SAKI 3Si-LS2 3D SPI Machine | Solder Paste Measurement

SAKI 3Si-LS2 3D SPI Machine | Solder Paste Measurement

Catch solder paste printing issues before components are placed. The SAKI 3Si-LS2 measures paste area, height and volume in 3D.

Isicelo esiKhawulezayo Email:smt-sales9@gdxinling.cn
Iinkcukacha

The SAKI 3Si-LS2 measures solder paste before component placement, providing numerical data on the printed deposits rather than relying only on visual appearance. Its published 12 μm optical-head configuration supports PCB sizes from 50 × 60 mm to 500 × 510 mm, making the LS2 format suitable for a broad range of board dimensions.

Inspection results include paste area, height and volume. The system can also check bridging, solder-paste horns and BGA coplanarity. These measurements help identify print variation at the stage where stencil alignment, paste application or cleaning can still be investigated before the board moves further down the line.

The 3Si-LS2 is a single-lane system. SAKI has described its SPI platform as supporting machine-to-machine communication, allowing inspection results to feed into compatible printer or placement-machine workflows when the appropriate interfaces are installed. This can help connect paste inspection with process adjustment rather than treating SPI as an isolated pass/fail station.

Iinkcukacha

IntoInkcazo
UphawuSAKI
Umzekelo3Si-LS2
Inspection StageSolder-paste printing
Lane ConfigurationSingle lane
Optical Head12 μm configuration documented
Ubungakanani bePCB50 × 60 to 500 × 510 mm for the documented configuration
Measurement ItemsPaste area, height and volume
Additional Inspection ItemsBridging, solder-paste horns, BGA coplanarity
Printer / Placement CommunicationSubject to installed interface and software
Power RequirementsConfirm the specific machine documentation

Configuration note: Confirm the installed optical head and communication options before specifying measurement performance or line integration capability. 

SAKI 3Di-MS3 3D AOI PCB Inspection Machine

Amanqaku anxulumeneyo acetyiswayo

Iingcebiso ezinxulumeneyo

Kutheni abantu abaninzi bekhetha ukusebenza ngeGeekValue?

Uphawu lwethu lusasazeka ukusuka kwisixeko ukuya kwisixeko, kwaye abantu abangenakubalwa bandibuze, "Yintoni iGeekValue?" Ivela kumbono olula: ukuxhobisa ukuqalwa kweTshayina ngetekhnoloji yokusika. Lo ngumoya wokuziphucula okuqhubekayo, ofihliweyo ekusukeleni kwethu iinkcukacha ezingayekiyo kunye nolonwabo lokugqithisa ebesikulindele ngalo lonke unikezelo. Obu buchule bobugcisa obuphantse bugqithise kunye nokuzinikela akukona nje ukuzingisa kwabaseki bethu, kodwa kunye nokubaluleka kunye nokufudumala kwe-brand yethu. Siyathemba ukuba uza kuqala apha kwaye usinike ithuba lokudala imfezeko. Masisebenze kunye ukwenza ummangaliso olandelayo othi "zero defect".

Iinkcukacha
GEEKVALUE

I-Geekvalue: Uzalelwe oomatshini bokuKhetha-neNdawo

Inkokeli yesisombululo esinye sokumisa i-chip mounter

Ngathi

Njengomthengisi wezixhobo kushishino lokwenziwa kombane, iGeekvalue ibonelela ngoluhlu loomatshini abatsha nabasele besetyenzisiwe kunye nezixhobo ezisuka kwiibrendi ezaziwayo ngamaxabiso akhuphisana kakhulu.

Idilesi yoqhagamshelwano:No. 18, Shangliao Industrial Road, Shajing Town, Baoan District, Shenzhen, China

Inombolo yefowuni yokubonisana:+86 13823218491

I-imeyile:smt-sales9@gdxinling.cn

QHAGAMSHELANA NATHI

© Onke Amalungelo Agciniwe. Inkxaso yobuGcisa:TiaoQingCMS

kfweixin

Skena ukongeza i-WeChat

Cela iQuote