en
ori
alb
amh
ara
arm
aym
aze
bel
ben
bos
bul
bur
cs
dan
de
div
el
est
fil
fin
fra
gle
glg
grn
heb
hi
hkm
hrv
hu
ice
id
it
jp
kan
kin
kor
lao
lav
lit
ltz
lug
mao
may
mlt
nep
nl
nor
nya
orm
per
pl
pt
rom
ru
san
sk
som
spa
srp
swa
swe
tam
th
tr
ukr
urd
vie
wel
xho
The SAKI 3Si-LS2 measures solder paste before component placement, providing numerical data on the printed deposits rather than relying only on visual appearance. Its published 12 μm optical-head configuration supports PCB sizes from 50 × 60 mm to 500 × 510 mm, making the LS2 format suitable for a broad range of board dimensions.
Inspection results include paste area, height and volume. The system can also check bridging, solder-paste horns and BGA coplanarity. These measurements help identify print variation at the stage where stencil alignment, paste application or cleaning can still be investigated before the board moves further down the line.
The 3Si-LS2 is a single-lane system. SAKI has described its SPI platform as supporting machine-to-machine communication, allowing inspection results to feed into compatible printer or placement-machine workflows when the appropriate interfaces are installed. This can help connect paste inspection with process adjustment rather than treating SPI as an isolated pass/fail station.
ຂໍ້ມູນຈໍາເພາະ
| ລາຍການ | ຂໍ້ມູນຈໍາເພາະ |
|---|---|
| ຍີ່ຫໍ້ | SAKI |
| ຕົວແບບ | 3Si-LS2 |
| Inspection Stage | Solder-paste printing |
| Lane Configuration | Single lane |
| Optical Head | 12 μm configuration documented |
| ຂະຫນາດ PCB | 50 × 60 to 500 × 510 mm for the documented configuration |
| Measurement Items | Paste area, height and volume |
| Additional Inspection Items | Bridging, solder-paste horns, BGA coplanarity |
| Printer / Placement Communication | Subject to installed interface and software |
| Power Requirements | Confirm the specific machine documentation |
Configuration note: Confirm the installed optical head and communication options before specifying measurement performance or line integration capability.
