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SAKI 3Si-LS2 3D SPI Machine | Solder Paste Measurement

SAKI 3Si-LS2 3D SPI Machine | Solder Paste Measurement

Catch solder paste printing issues before components are placed. The SAKI 3Si-LS2 measures paste area, height and volume in 3D.

Gadifageenyaan

The SAKI 3Si-LS2 measures solder paste before component placement, providing numerical data on the printed deposits rather than relying only on visual appearance. Its published 12 μm optical-head configuration supports PCB sizes from 50 × 60 mm to 500 × 510 mm, making the LS2 format suitable for a broad range of board dimensions.

Inspection results include paste area, height and volume. The system can also check bridging, solder-paste horns and BGA coplanarity. These measurements help identify print variation at the stage where stencil alignment, paste application or cleaning can still be investigated before the board moves further down the line.

The 3Si-LS2 is a single-lane system. SAKI has described its SPI platform as supporting machine-to-machine communication, allowing inspection results to feed into compatible printer or placement-machine workflows when the appropriate interfaces are installed. This can help connect paste inspection with process adjustment rather than treating SPI as an isolated pass/fail station.

Ispeesifikeeshiniiwwan

WantaIspeesifikeeshinii
Maqaa oomishaaSAKI
Adda duree3Si-LS2
Inspection StageSolder-paste printing
Lane ConfigurationSingle lane
Optical Head12 μm configuration documented
Guddina PCB50 × 60 to 500 × 510 mm for the documented configuration
Measurement ItemsPaste area, height and volume
Additional Inspection ItemsBridging, solder-paste horns, BGA coplanarity
Printer / Placement CommunicationSubject to installed interface and software
Power RequirementsConfirm the specific machine documentation

Configuration note: Confirm the installed optical head and communication options before specifying measurement performance or line integration capability. 

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