en
ori
alb
amh
ara
arm
aym
aze
bel
ben
bos
bul
bur
cs
dan
de
div
el
est
fil
fin
fra
gle
glg
grn
heb
hi
hkm
hrv
hu
ice
id
it
jp
kan
kin
kor
lao
lav
lit
ltz
lug
mao
may
mlt
nep
nl
nor
nya
orm
per
pl
pt
rom
ru
san
sk
som
spa
srp
swa
swe
tam
th
tr
ukr
urd
vie
wel
xho
Component position alone does not reveal every assembly defect. The SAKI 3Di-MS3 adds height measurement to optical inspection, providing information about raised leads, lifted components and visible solder-joint geometry.
Multi-frequency digital projection captures the board’s three-dimensional surface. Automatic warpage compensation establishes the reference for height measurements across the PCB, including areas where the board is not perfectly flat. Optional side cameras provide additional views around connectors, shields and component leads.
The single-lane platform handles boards up to 330 × 330 mm. Its BF2 software stores inspection images for defect review and offline program adjustment, allowing inspection libraries to be refined without repeatedly loading the physical board.
SAKI 3Di-MS3 Core Technical Specifications
| Параметр | Спецыфікацыя |
|---|---|
| Мадэль | 3Di-MS3 |
| Тып праверкі | Inline 3D AOI |
| Conveyor | Single lane |
| Памер друкаванай платы | 50 × 60 to 330 × 330 mm |
| Optical Resolution Options | 8 μm / 15 μm |
| Дыяпазон вымярэнняў вышыні | 25 mm; up to 40 mm with Z-axis option |
| PCB Clearance | Top: 40 mm / bottom: 60 mm |
| Dimensions, W × D × H | 850 × 1,430 × 1,500 mm |
| Вага | Approximately 850 kg |
