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Component position alone does not reveal every assembly defect. The SAKI 3Di-MS3 adds height measurement to optical inspection, providing information about raised leads, lifted components and visible solder-joint geometry.
Multi-frequency digital projection captures the board’s three-dimensional surface. Automatic warpage compensation establishes the reference for height measurements across the PCB, including areas where the board is not perfectly flat. Optional side cameras provide additional views around connectors, shields and component leads.
The single-lane platform handles boards up to 330 × 330 mm. Its BF2 software stores inspection images for defect review and offline program adjustment, allowing inspection libraries to be refined without repeatedly loading the physical board.
SAKI 3Di-MS3 Core Technical Specifications
| Tham số | Đặc điểm kỹ thuật |
|---|---|
| Người mẫu | 3Di-MS3 |
| Loại kiểm tra | Inline 3D AOI |
| Băng tải | Một làn đường |
| Kích thước PCB | 50 × 60 to 330 × 330 mm |
| Optical Resolution Options | 8μm / 15μm |
| Phạm vi đo chiều cao | 25 mm; up to 40 mm with Z-axis option |
| Giải phóng PCB | Top: 40 mm / bottom: 60 mm |
| Dimensions, W × D × H | 850 × 1.430 × 1.500 mm |
| Cân nặng | Approximately 850 kg |
