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SAKI 3Di-MS3 Inline 3D AOI Machine

SAKI 3Di-MS3 Inline 3D AOI Machine

SAKI 3Di-MS3 combines 3D measurement, board-warpage compensation and offline image review. Explore used AOI equipment for PCBs up to 330 × 330 mm.

Gusaba Byihuse Email:smt-sales9@gdxinling.cn
Ibisobanuro

Component position alone does not reveal every assembly defect. The SAKI 3Di-MS3 adds height measurement to optical inspection, providing information about raised leads, lifted components and visible solder-joint geometry.

Multi-frequency digital projection captures the board’s three-dimensional surface. Automatic warpage compensation establishes the reference for height measurements across the PCB, including areas where the board is not perfectly flat. Optional side cameras provide additional views around connectors, shields and component leads.

The single-lane platform handles boards up to 330 × 330 mm. Its BF2 software stores inspection images for defect review and offline program adjustment, allowing inspection libraries to be refined without repeatedly loading the physical board.

SAKI 3Di-MS3 Core Technical Specifications

ParameterIbisobanuro
Icyitegererezo3Di-MS3
Ubwoko bw'UbugenzuziInline 3D AOI
ConveyorSingle lane
Ingano ya PCB50 × 60 to 330 × 330 mm
Optical Resolution Options8 μm / 15 μm
Urwego rwo gupima uburebure25 mm; up to 40 mm with Z-axis option
PCB ClearanceTop: 40 mm / bottom: 60 mm
Dimensions, W × D × H850 × 1,430 × 1,500 mm
IbiroApproximately 850 kg

SAKI 3Di-MS3 inline 3D automated optical inspection machine

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Aderesi ya:No 18, Umuhanda w'inganda Shangliao, Umujyi wa Shajing, Akarere ka Baoan, Shenzhen, Ubushinwa

Inomero ya terefone:+86 13823218491

Imeri:smt-sales9@gdxinling.cn

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