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SAKI 3Di-MS3 Inline 3D AOI Machine

SAKI 3Di-MS3 Inline 3D AOI Machine

SAKI 3Di-MS3 combines 3D measurement, board-warpage compensation and offline image review. Explore used AOI equipment for PCBs up to 330 × 330 mm.

Gaaffii Saffisaa Email:smt-sales9@gdxinling.cn
Gadifageenyaan

Component position alone does not reveal every assembly defect. The SAKI 3Di-MS3 adds height measurement to optical inspection, providing information about raised leads, lifted components and visible solder-joint geometry.

Multi-frequency digital projection captures the board’s three-dimensional surface. Automatic warpage compensation establishes the reference for height measurements across the PCB, including areas where the board is not perfectly flat. Optional side cameras provide additional views around connectors, shields and component leads.

The single-lane platform handles boards up to 330 × 330 mm. Its BF2 software stores inspection images for defect review and offline program adjustment, allowing inspection libraries to be refined without repeatedly loading the physical board.

SAKI 3Di-MS3 Core Technical Specifications

PaarameetariiIspeesifikeeshinii
Adda duree3Di-MS3
Gosa InspeekshiniiInline 3D AOI
ConveyorSingle lane
Guddina PCB50 × 60 to 330 × 330 mm
Optical Resolution Options8 μm / 15 μm
Daangaa Safartuu Olka’iinsaa25 mm; up to 40 mm with Z-axis option
PCB ClearanceTop: 40 mm / bottom: 60 mm
Dimensions, W × D × H850 × 1,430 × 1,500 mm
UlfaatinaApproximately 850 kg

SAKI 3Di-MS3 inline 3D automated optical inspection machine

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Lakkoofsa bilbilaa marii:+86 13823218491

Imeelii:smt-gurgurtaa9@gdxinling.cn irraa argattu

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