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Component position alone does not reveal every assembly defect. The SAKI 3Di-MS3 adds height measurement to optical inspection, providing information about raised leads, lifted components and visible solder-joint geometry.
Multi-frequency digital projection captures the board’s three-dimensional surface. Automatic warpage compensation establishes the reference for height measurements across the PCB, including areas where the board is not perfectly flat. Optional side cameras provide additional views around connectors, shields and component leads.
The single-lane platform handles boards up to 330 × 330 mm. Its BF2 software stores inspection images for defect review and offline program adjustment, allowing inspection libraries to be refined without repeatedly loading the physical board.
SAKI 3Di-MS3 Core Technical Specifications
| Parametr | Specyfikacja |
|---|---|
| Model | 3Di-MS3 |
| Rodzaj inspekcji | Inline 3D AOI |
| Przenośnik | Pojedynczy pas |
| Rozmiar PCB | 50 × 60 to 330 × 330 mm |
| Optical Resolution Options | 8μm / 15μm |
| Zakres pomiaru wysokości | 25 mm; up to 40 mm with Z-axis option |
| Prześwit PCB | Top: 40 mm / bottom: 60 mm |
| Dimensions, W × D × H | 850 × 1430 × 1500 mm |
| Waga | Approximately 850 kg |
