MRSI-705 nkola ya die-cement ekola ku sipiidi ya waggulu, ennyangu era ekyukakyuka, ng’erina emirimu emikulu omuli okugaba, die-cement, eutectic welding, flip-chip welding ne epoxy die-cement adhesive. Esaanira enkulaakulana y'ebintu, okufulumya obutono okutuuka ku kibinja, okufulumya chassis mu bungi bwa layisi, ebyuma, modulators, AOC, WDM / EML TO-Can, optical transceivers, LiDAR, VR / AR, sensa n'okukuba ebifaananyi eby'amaaso, okuwa "one-stop." " "Okugonjoola
Ebirungi ebirimu
Olw’obutuufu obutuuka ku microns 5 n’obusobozi okukozesa amaanyi g’ekisumuluzo agatuuka ku 500N mu kiseera ky’okusiba, MRSI-705 esaanira okupakinga enkola ey’omulembe
Enkola eno esobola okukola emirimu egy’enjawulo: Enkola eno esobola okukola emirimu egy’enjawulo (multi-chip and multi-process applications) mu kyuma kimu, omuli okukyusakyusa ensonga mu ngeri ey’otoma n’okuweta layisi, eutectics ezibuguma waggulu ne wansi, okunnyika n’okugaba epoxy resin
Okufulumya obulungi: MRSI-705 eriko enkola y'okukyusa entuuyo "zero time", erongoosa nnyo enkola y'okufulumya obulungi
Okutebenkera: Enkola eno esikira okukyukakyuka n’okutebenkera kw’omusingi gwa MRSI-705, nga gulina okutebenkera okukakasibwa okukulembedde mu makolero, ekikendeeza ku budde bw’ekyuma
Okukozesebwa mu bugazi: Esaanira ebyetaago eby’enjawulo eby’okupakinga, omuli okupakinga wafer chip (CoW), carrier chip (CoC), PCB, TO ne tube shell
Ebitundu by’okusaba
MRSI-705 ekozesebwa nnyo mu layisi, inertial, modulators, AOC, WDM/EML R&D n’okukola TO-Can, optical transceivers, LiDAR, VR/AR, sensa n’ebintu ebikuba ebifaananyi eby’amaaso. Amaanyi gaayo n’okukola obulungi ennyo bigifuula ekintu ekirungi ennyo ekiteekebwa mu mmotoka mu bintu bino.
