MRSI Systems Die Bonding Machine mrsi-705

MRSI-705 waa xawaare sare, ku habboon oo dabacsan nidaamka sibidhka dhinta, oo leh hawlo muhiim ah oo ay ka mid yihiin qaybinta, sibidhka-dhimista, alxanka eutectic, alxanka flip-chip iyo xabagta epoxy die-cement. Waxay ku habboon tahay horumarinta badeecada, wax soo saarka yar yar ilaa wax soo saarka, wax-soo-saarka cufan ee leysarka, qalabka, modulators, AOC, WDM / EML TO-Can, transceivers indhaha, LiDAR, VR / AR, dareemayaasha iyo sawirka indhaha, bixinta "hal joogsi " "Xal

Faa'iidooyinka

Iyada oo sax ah ilaa 5 microns iyo awoodda lagu dabaqo xoogga furaha ilaa 500N inta lagu jiro furayaasha, MRSI-705 waxay ku habboon tahay baakadaha nidaamka horumarsan.

Kala duwanaansho: Nidaamku wuxuu wax ka qaban karaa codsiyada badan ee chips iyo geeddi-socodka badan ee hal mashiin, oo ay ku jiraan beddelka caarada tooska ah iyo alxanka laysarka, kuleylka sare iyo hoose ee eutectics, shubista resin epoxy iyo qaybinta

Wax soo saar hufan: MRSI-705 waxay ku qalabaysan tahay "eber time" nidaamka beddelidda biibiile, kaas oo si weyn u wanaajinaya waxtarka wax soo saarka

Xasilooni: Nidaamku wuxuu dhaxlaa dabacsanaanta iyo xasilloonida madal MRSI-705, oo leh xasillooni hoggaamineed warshadeed oo shahaadaysan, taasoo yaraynaysa wakhtiga mashiinka

Codsiga ballaaran: Ku habboon baakadaha kala duwan, oo ay ku jiraan chip wafer (CoW), chip side (CoC), PCB, TO iyo baakadaha qolofka tuubada

Goobaha codsiga

MRSI-705 waxaa si weyn loogu isticmaalaa lasers, inertial, modulators, AOC, WDM / EML R & D iyo wax soo saarka ee TO-Can, transceivers indhaha, LiDAR, VR / AR, dareemayaal iyo alaabta sawir indhaha. Isticmaalkeeda koronto iyo waxtarkeeda sare ayaa ka dhigaya aalad ku habboon baabuur-ku-saaran dhinacyadan.