ekyuma kya vitrox 3d x-ray v810

Vitrox 3D X-ray V810 erina emirimu n’ebirungi eby’enjawulo, okusinga omuli okuzuula ku sipiidi ey’amaanyi, enkola ez’amaanyi ez’okugezesa, okukola pulogulaamu ez’amagezi, okuwagira emikutu mingi, okumala ebbanga eddene erya X-ray tube, okukendeeza ku bulabe bw’okwonooneka kw’obusannyalazo, n’ebirala.

Enkola

V810 erina omulimu gw’okuzuula emisinde egy’amaanyi era esobola okumaliriza amangu emirimu gy’okuzuula emisinde egy’amaanyi.

Enkola y’okugezesa ey’amaanyi: Enkola yaayo ey’okugezesa ekakasa nti ebiyungo bya solder byonna bisobola okwekebejjebwa mu bujjuvu nga bibikka nnyo naddala nga bisaanira ebintu nga seeva n’ebyuma by’emmotoka

Smart programming: Ewagira programming ya lightning okusobola okutuuka ku programming amagezi era ennyangu

Obuwagizi bwa platform eziwera: Esaanira circuit boards eza sayizi ez’enjawulo okutuukiriza ebyetaago eby’enjawulo eby’okuzuula

Okwongezaayo otulo twa X-ray tube: Twala dizayini ya tube enzigale okukendeeza ku kufiirwa kwa X-ray tube n’okulongoosa otulo bw’ebyuma

Okukendeeza ku bulabe bw’okwonooneka kw’obusannyalazo: Okukendeeza ku kwonooneka kw’obusannyalazo ku busannyalazo obw’ekika kya DRAM okuyita mu budde bwonna obw’okugezesa

Ebirungi ebirimu

Omuwendo gw’abayizi abagezesebwa ogw’oku ntikko: Okukakasa nti okwekenneenya okujjuvu kw’ebiyungo byonna ebya solder okukakasa omutindo gw’ebintu

Okukendeeza ku budde bw’okuteekawo pulogulaamu : Teeka ebitundu by’okussa essira ku POP n’emirimu gy’okweyiga okukendeeza ku budde bw’okuteekawo pulogulaamu n’okusooka

Intelligent package database: Ebipande byonna eby’okufulumya bikozesa database package y’okusengeka okulongoosa obulungi bw’okuzuula n’obutuufu

Tekinologiya w’ebifaananyi bya slice ow’omulembe: Waayo ebifaananyi bya slice eby’omulembe ogwokubiri ne maapu z’ebifaananyi bya solder profile okusobola okugonjoola ebizibu

Tekinologiya w’okusiba otomatiki alina patent: Teeka otomatiki layer esala ku buwanvu obwetaagisa nga totambuza X-ray tube oba loading platform

Ekifaananyi kya 3D CT: Okuwagira ebikozesebwa mu kulaba model ya 3D okusobola okuwa amawulire agakwata ku bifaananyi agagagga

Omulimu gw’okuzzaawo ebifaananyi: Okulongoosa obutuufu bw’ebifaananyi ebya 2.5D, abaddukanya basobole okusalawo obulungi

Okulonda ekika ky’ebiyungo bya solder ebingi: Okuwagira algorithms ezisukka mu 2 ez’omulembe ku bika 0 eby’ebiyungo bya solder okulongoosa obutuufu bw’okuzuula

Tekinologiya wa phase shift: Okulongoosa obutuufu bw’okugezesa n’okubikka ku biyungo bya press-in plug-in ne through-hole device boards

Okulongoosa mu butuufu bw’okuzuula ebiwujjo: Enkola empya ey’okuzuula ebiwujjo erongoosa obutuufu bw’okuzuula ebiwujjo ku bika by’ebitundu eby’enjawulo

Okuzuula PTH: Goberera IPC ng’oyita mu mutindo gwa creep tin era okuwa okusalawo mu bujjuvu obuwanvu bwa ppini ya PTH

BGA okuzuula: Okwongera ku muwendo gwa BGA solder ball cutting layers okulongoosa HIP defect detection rate

Okusalawo obulema mu ngeri ey’otoma: Teeka omulimu gw’okusalawo mu ngeri ey’otoma ku biyungo bya solder ebiriko obuzibu okukendeeza ku mulimu gw’okuddamu okusalawo mu ngalo