SAKI 3Si-MS2 3D SPI Machine | SMT Inspection

The SAKI 3Si-MS2 is a single-lane 3D solder paste inspection (SPI) machine for SMT production lines. It inspects solder paste deposits on printed circuit boards (PCBs) after printing, using 3D measurement technology to assess paste deposition and identify printing defects.

The 3Si-MS2 supports optical resolutions of 7 μm, 12 μm, and 18 μm, depending on the selected optical head. Its 3D measurement system provides data for evaluating solder paste deposits, including height-related measurements. Inspection results can help identify printing issues and assess solder paste distribution across PCB pads.

The system is used at the solder paste printing stage of SMT assembly, before component placement. This allows printing results to be checked before the PCB moves to the next production process.

SAKI 3Si-MS2 Technical Specifications

PCB Size Compatibility

According to SAKI's 3Si series specifications, the supported PCB size for the 3Si-MS2 varies with the selected optical head:

• 7 μm optical head: 50 × 60 mm to 330 × 330 mm

• 12 μm or 18 μm optical head: 50 × 60 mm to 500 × 510 mm

Confirm the installed optical head and machine configuration before checking compatibility with your PCB production requirements.

Contact Us for Pricing and Availability

Looking for a SAKI 3Si-MS2 3D SPI machine? Contact us to inquire about current availability, machine condition, configuration, and pricing. We can also help you review the available technical specifications and determine whether the equipment matches your SMT production requirements.