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The SAKI 3Si-MS2 is a single-lane 3D solder paste inspection (SPI) machine for SMT production lines. It inspects solder paste deposits on printed circuit boards (PCBs) after printing, using 3D measurement technology to assess paste deposition and identify printing defects.
The 3Si-MS2 supports optical resolutions of 7 μm, 12 μm, and 18 μm, depending on the selected optical head. Its 3D measurement system provides data for evaluating solder paste deposits, including height-related measurements. Inspection results can help identify printing issues and assess solder paste distribution across PCB pads.
The system is used at the solder paste printing stage of SMT assembly, before component placement. This allows printing results to be checked before the PCB moves to the next production process.
SAKI 3Si-MS2 Technical Specifications
| Specification | Details |
|---|---|
| Manufacturer | SAKI Corporation |
| Model | 3Si-MS2 |
| Equipment Type | 3D Solder Paste Inspection Machine |
| Production Line | Single lane |
| Optical Resolution | 7 μm / 12 μm / 18 μm |
| Solder Paste Height Measurement Range | 500 μm |
| Machine Dimensions (W × D × H) | 850 × 1,430 × 1,500 mm |
| Machine Weight | Approx. 850 kg |
| Power Supply | Single-phase 200–240 V ±10%, 50/60 Hz |
| Air Supply | 0.5 MPa, 5 L/min (ANR) |
| PCB Size | Depends on optical head configuration |
PCB Size Compatibility
According to SAKI's 3Si series specifications, the supported PCB size for the 3Si-MS2 varies with the selected optical head:
7 μm optical head: 50 × 60 mm to 330 × 330 mm
12 μm or 18 μm optical head: 50 × 60 mm to 500 × 510 mm
Confirm the installed optical head and machine configuration before checking compatibility with your PCB production requirements.
Contact Us for Pricing and Availability
Looking for a SAKI 3Si-MS2 3D SPI machine? Contact us to inquire about current availability, machine condition, configuration, and pricing. We can also help you review the available technical specifications and determine whether the equipment matches your SMT production requirements.
