sony pick and place machine f130ai

The main advantages and features of Sony's F130AI placement machine include:

‌High-speed placement capability‌: The F130AI placement machine has a placement speed of up to 25,900 CPH (25,900 components per minute), which can efficiently complete large-scale production tasks ‌

‌High-precision placement‌: Its placement accuracy reaches 50 microns (CPK1.0 or above), ensuring high-precision component placement, suitable for the manufacture of high-density circuit boards ‌

‌Versatility‌: The placement machine is suitable for the placement of a variety of components, including 0402 (01005) to 12 mm IC components, and fixed placement of 6 mm to 25 mm IC components, suitable for a variety of application scenarios ‌

‌Long substrate support‌: The F130AI supports substrate placement up to 1200 mm, suitable for large PCB manufacturing

Flexibility and reliability: The F130AI placement machine is equipped with Sony's unique planetary lightweight head, which has excellent performance-price ratio and reliability, and is suitable for long-term use

Technical parameters:

Substrate size: 50 mm 50 mm to 360 mm 1200 mm Substrate thickness: 0.5 mm to 2.6 mm Number of placement heads: 1 head, 12 nozzles Placement range: 0402 (01005) to 12 mm IC components, 6 mm to 25 mm IC components Component height: Maximum 6 mm Placement speed: 0.139 seconds (25900 CPH)

‌Placement accuracy: 50 microns (CPK1.0 or above)

‌Power supply: AC3 phase 200V±10%, 50/60HZ, power consumption 2.3 kW

‌Gas consumption: 0.49MPA, 50L/min

‌External dimensions: 1220mm 1400mm 1545mm

‌Weight: 18560kg