parmi smt 3d spi hs60

The main features and benefits of the PARMI 3D HS60 solder paste inspection equipment include‌‌:

Enabled and fast inspection: The PARMI 3D HS60 solder paste inspection system has good measurement speed and resolution. The measurement speed is 100cm2/sec at 13x13um resolution and 80cm2/sec at 10x10um resolution, capable of inspecting pads smaller than 0.1005 and components as small as 100um in size‌

‌Advanced sensor technology‌: The equipment is based on the RSC-6 sensor developed by PARMI, and the inspection cycle time is greatly reduced. The RSC sensor uses dual laser projection shadowless technology, real-time PCB warpage tracking and warp measurement, providing true 3D shape and color 2D images‌‌

‌High stability and long life‌: The PARMI laser head is linearly mounted on the motor, providing stable continuous motion, eliminating the impact of vibration on accuracy, and ensuring long-term stable operation. The design of the linear motor makes the equipment last longer and the maintenance cost queue ‌

‌Multi-function detection‌: HS60 can detect multiple parameters such as height, area, volume, offset and bridge, which is suitable for the detection needs of various solder paste configurations and component configurations ‌

‌User interface‌: The equipment uses a full Chinese LCD display, and the operation interface is used for drawing teaching, which is suitable for users with different skill levels ‌

‌High-resolution image‌: HS60 uses a high frame rate C-MOS sensor with a pixel resolution of 18x18um, which can generate high-quality 3D images to ensure the accuracy of the detection results