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Iimpawu eziphambili kunye nezibonelelo zePARMI 3D HS60 izixhobo zokuhlola i-solder yokuhlola ziquka:
Ukuhlolwa okunikwe amandla kunye nokukhawuleza: I-PARMI 3D HS60 inkqubo yokuhlola i-solder paste inesantya esihle sokulinganisa kunye nesisombululo. Isantya sokulinganisa yi-100cm2/sec kwisisombululo se-13x13um kunye ne-80cm2/sec kwisisombululo se-10x10um, esikwazi ukuhlola iipads ezincinci kune-0.1005 kunye namacandelo amancinci njenge-100um ngobukhulu.
I-teknoloji ye-sensor ephezulu: Izixhobo zisekelwe kwi-RSC-6 inzwa eyenziwe yi-PARMI, kwaye ixesha lomjikelezo wokuhlola liyancipha kakhulu. Isivamvo se-RSC sisebenzisa itekhnoloji ye-laser ye-laser ebonisa itekhnoloji engenasithunzi, i-PCB yexesha langempela lokulandela umkhondo we-warpage kunye nomlinganiso we-warp, ukubonelela ubume bokwenyani be-3D kunye nombala wemifanekiso ye-2D.
Ukuzinza okuphezulu kunye nobomi obude: Intloko ye-laser ye-PARMI ifakwe ngokufanelekileyo kwi-motor, inika ukunyakaza okuzinzile okuqhubekayo, ukuphelisa impembelelo ye-vibration ngokuchanekileyo, kunye nokuqinisekisa ukusebenza okuzinzile kwexesha elide. Uyilo lwenjini yomgca lwenza ukuba izixhobo zihlale ixesha elide kunye nomgca weendleko zokugcina
Ukufunyanwa kwemisebenzi emininzi: I-HS60 inokubona iiparitha ezininzi ezifana nobude, indawo, umthamo, i-offset kunye nebhulorho, efanelekileyo kwiimfuno zokubona ukucwangciswa kwe-solder paste kunye noqwalaselo lwamacandelo.
Ujongano lomsebenzisi: Isixhobo sisebenzisa umboniso ogcweleyo weLCD waseTshayina, kwaye ujongano lokusebenza lusetyenziselwa ukufundisa ukuzoba, olulungele abasebenzisi abanamanqanaba ahlukeneyo ezakhono.
Umfanekiso ophakamileyo ophezulu: I-HS60 isebenzisa isantya esiphezulu se-C-MOS sensor kunye nesisombululo se-pixel ye-18x18um, enokuvelisa imifanekiso ephezulu ye-3D ukuqinisekisa ukuchaneka kweziphumo zokubona.
