‌Mirtec SMT 3D SPI‌ VCTA-V850

‌VCTA-V850 is a solder paste thickness detector, which is mainly used to detect solder paste thickness and ensure the quality of patch processing. ‌

Functions and Roles

The main functions of VCTA-V850 include:

‌Solder paste thickness detection‌: Through high-definition, high-speed cameras with high-field telecentric lenses, accurate measurement of solder paste thickness is achieved.

‌High frame rate shooting‌: GPU large-scale parallel technology is used to improve calculation and detection speed, and effectively deal with problems such as FPC warping.

‌Three-dimensional stereo image display‌: Phase modulation profile measurement technology (PMP) is used to obtain high-precision object shape contour and volume measurement results, and display true color three-dimensional stereo images.

‌Diversified functional modules‌: Including red glue detection, bare board learning programming, automatic board bending compensation, camera barcode recognition, offline programming and debugging and other functions.

Technical parameters

‌Detection resolution‌: 8-bit grayscale resolution, reaching a detection resolution of 0.37 microns.

‌Detection capability‌: Compared with laser measurement accuracy, the accuracy is improved by 2 orders of magnitude, which greatly improves the detection capability and application range of the equipment.

‌Display effect‌: Adopting the self-developed RGB three-color light source, 3D and 2D true color images are realized, and the display effect is extremely close to the real object‌.

Application scenario

VCTA-V850 is suitable for the field of SMT patch processing, especially for the scene that requires high-precision solder paste thickness detection. Its high definition and high precision make it have a wide range of application prospects in the electronic manufacturing industry‌

SMT solder paste thickness tester can detect the following undesirable situations‌:

Insufficient or excessive solder paste printing volume‌: By measuring the thickness of solder paste, it can be judged whether the printing volume of solder paste meets the standard, avoiding the problem of insufficient solder paste causing unstable welding or excessive solder paste causing short circuit.

Solder paste printing height deviation‌: The tester can measure the height of solder paste and determine whether there are uneven phenomena such as pulling tip and collapse, which will affect the welding quality.

Insufficient solder paste printing area or volume‌: By measuring the area and volume of solder paste, it can be judged whether the solder paste covers the pad evenly, avoiding the situation of continuous solder or unstable welding during welding.‌

Solder paste printing flatness problem: The tester can detect the continuity, collapse, and tipping of solder paste on the PCB pad, which will affect the welding quality.