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TR7007SIII is suitable for various scenarios that require high-precision solder paste printing detection
Supports three resolutions of 7μm, 12μm, and 18μm, suitable for high-precision solder paste inspection needs.
High-precision detection: Mirtec SPI MS-11e is equipped with a 15-megapixel camera, which can achieve high-precision 3D detection. Its height resolution reaches 0.1μm, height accuracy is 2μm, and he
VCTA-V850 is a solder paste thickness detector, which is mainly used to detect the thickness of solder paste and ensure the quality of patch processing.
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