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SAKI 3Si-MS2 is a new generation of 3D solder paste inspection system (SPI) launched by SAKI. It adopts innovative multi-spectral measurement technology and is designed for quality con...
SAKI 3Si-LS2 is an advanced 3D solder paste inspection equipment (SPI) that uses laser triangulation technology and is designed for high-precision solder paste printing process quality control
SAKI 3Si-LS3EX is the latest high-end 3D solder paste inspection system (SPI) launched by SAKI of Japan. It adopts multi-spectral confocal imaging technology
SAKI BF-3Si-L2 is a high-precision 3D solder paste inspection system (SPI) launched by SAKI of Japan, which is specially designed for the quality control of solder paste printing proce...
Koh Young SPI 8080 is able to achieve the fastest inspection in the industry while maintaining high accuracy
The SE600 is CyberOptics' flagship model and is part of the SPI system. It brings together the highest accuracy and world-class serviceability to provide a high-performance platform
KY8030-3 can meet the 01005 detection speed standard and has high-speed detection capabilities
The PARMI 3D HS60 solder paste inspection system has good measurement speed and resolution
PARMI HS70 series uses the speed RSC_6 sensor, which shortens the entire detection time
Bentron SPI 7700E adopts 2D+3D algorithm, which can provide high-precision solder paste thickness detection to ensure welding quality
Both X/Y axes are equipped with linear motors, with a motion accuracy of ±3um to ensure the accuracy of detection.
Provides full 3D inspection, and the optical resolution can be selected as 10µm or 15µm to ensure high-precision inspection results.
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As a supplier of equipment for the electronics manufacturing industry, Geekvalue offers a range of new and used machines and accessories from renowned brands at very competitive prices.
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