SAKI BF-3Si-L2 SMT 3d spi machine

SAKI BF-3Si-L2 is a high-precision 3D solder paste inspection system (SPI) launched by SAKI of Japan, which is specially designed for the quality control of solder paste printing process on SMT production lines. The equipment uses multi-angle 3D imaging technology to accurately measure key parameters such as height, volume, and area of solder paste to ensure that the printing quality meets the requirements of high-density electronic assembly.

Core advantages:

Ultra-high precision: ±1μm height measurement accuracy

High-speed detection: 0.03 seconds/test point (industry leading)

Intelligent closed-loop control: supports automatic parameter adjustment in conjunction with the printer

2. Core specifications and technical parameters

Hardware configuration

Components Specifications Technical features

Optical system Multi-angle laser scanning + high-resolution CCD 3D imaging accuracy ±1μm

Light source Blue laser (405nm) + white light LED Reduce reflection interference

Motion system Linear motor drive Repeat positioning accuracy ±3μm

Detection range Maximum board size 510×460mm Expandable to 610×510mm

Key performance indicators

Parameters Indicators

Minimum detection pad size 0.1×0.1mm

Height measurement range 0-200μm (expandable to 500μm)

Detection speed 0.03 seconds/test point (simple feature)

Measurement accuracy Height ±1μm, volume ±3%

Communication interface SECS/GEM, TCP/IP, PLC I/O

3. System advantages and innovative technologies

Five core advantages

True 3D measurement:

Multi-angle laser triangulation measurement technology is used to eliminate shadow effects

Can detect fine-pitch solder paste (such as 01005 component pads)

AI intelligent analysis:

Automatically identify defects such as solder paste tipping, bridging, and insufficient tin

Support dynamic tolerance adjustment (automatically optimize standards according to pad size)

Closed-loop control:

Real-time data feedback to the printer (supports mainstream brands such as DEK and MPM)

Automatically adjust parameters such as scraper pressure and speed

High speed and high precision:

Patented parallel scanning technology increases detection speed by 30%

0.1μm Z-axis resolution

User-friendly design:

15-inch touch screen operation interface

Support offline programming (does not affect production rhythm)

4. Operation specifications and precautions

Equipment installation requirements

Item Standard requirements

Ambient temperature 20±2℃ (constant temperature workshop)

Humidity range 40-60% RH

Vibration isolation Vibration amplitude <1μm (it is recommended to install anti-vibration pads)

Power supply specifications 220V±5%/50Hz (independent grounding <4Ω)

Daily operation precautions

Power-on process:

First start the host power → preheat for 10 minutes → perform automatic calibration

Use standard height calibration block to verify accuracy every day

PCB placement specifications:

Use vacuum adsorption to fix PCB (to prevent warping from affecting measurement)

Board edge distance to the inner wall of the device ≥30mm

Detection parameter setting:

Select different reflectivity parameters according to solder paste type (SnPb/SAC305)

It is recommended to enable micro-area scanning mode for high-density boards

Safety precautions:

Do not look directly at the laser light source (Class 2M laser protection standard)

Check the emergency stop button function every week

5. Common errors and troubleshooting

Hardware failures

Error code Fault phenomenon Solution

HW101 Laser is not ready Check the laser power connection → Restart the device

HW205 Z-axis movement exceeds the limit Check the PCB thickness setting → Clean the foreign matter on the guide rail

HW308 Camera communication failed Replug the Camera Link cable

Typical detection problem handling

Measurement data fluctuates greatly:

Clean the glass calibration board

Check whether the ambient temperature and humidity are stable

Blurred solder paste edge:

Adjust the laser incident angle (30-45° is recommended)

Update lens focus parameters

6. Typical application cases

Case 1: Smartphone motherboard detection

Challenges:

0.3mm pitch BGA solder paste detection

Require volume control within ±5%

Solution:

Enable micro focus scanning mode (5μm spot diameter)

Set dynamic tolerance band (center area ±3%, edge ±5%)

Case 2: Automobile ECU production

Special requirements:

100% full inspection and data traceability

Detection speed ≤15 seconds/board

Implementation plan:

Use flying scanning technology (continuous detection without stopping)

Direct connection with MES system (automatically generate CPK report)