SAKI BF-3Si-L2 SMT 3D SPI Machine

SAKI BF-3Si-L2 ndi yolondola kwambiri ya 3D solder paste inspection system (SPI) yomwe idakhazikitsidwa ndi SAKI waku Japan, yomwe idapangidwa mwapadera kuti iziwongolera njira yosindikizira ya solder pamizere yopanga ma SMT. Zipangizozi zimagwiritsa ntchito luso lamakono lojambula zithunzi za 3D kuti muyese molondola magawo ofunikira monga kutalika, voliyumu, ndi malo a solder phala kuti zitsimikizire kuti khalidwe losindikiza likukwaniritsa zofunikira za msonkhano wamagetsi wapamwamba kwambiri.

Ubwino waukulu:

Kulondola kwambiri: ± 1μm kutalika kwake muyeso

Kuzindikira kothamanga kwambiri: 0.03 masekondi / malo oyesera (otsogolera mafakitale)

Kuwongolera kotsekeka kwanzeru: kumathandizira kusintha kosinthika molumikizana ndi chosindikizira

2. Mafotokozedwe apakati ndi magawo aukadaulo

Kukonzekera kwa Hardware

Mfundo Zazigawo Zaukadaulo

Optical system Mipikisano ngodya laser kupanga sikani + mkulu kusamvana CCD 3D kujambula kulondola ± 1μm

Gwero lowala Lalasi wabuluu (405nm) + kuwala koyera LED Chepetsani kusokoneza

Zoyenda dongosolo Liniya galimoto galimoto Bwerezani malo olondola ± 3μm

Kuzindikira osiyanasiyana Kukula kwakukulu kwa bolodi 510 × 460mm Kukula mpaka 610 × 510mm

Zizindikiro zazikulu za ntchito

Zizindikiro za Parameters

Kukula kocheperako pad 0.1 × 0.1mm

Muyezo wautali 0-200μm (wokulitsa mpaka 500μm)

Kuthamanga kwa 0.03 masekondi / malo oyesera (chinthu chosavuta)

Kuyeza kulondola Kutalika ± 1μm, voliyumu ± 3%

Kuyankhulana kwa SECS/GEM, TCP/IP, PLC I/O

3. Ubwino wa dongosolo ndi matekinoloje atsopano

Zisanu zabwino zabwino

Muyezo weniweni wa 3D:

Tekinoloje yoyezera ma triangulation ya Multi-angle laser imagwiritsidwa ntchito kuthetsa zotsatira za mthunzi

Itha kuzindikira phala la solder (monga 01005 chigawo chapads)

Kusanthula kwanzeru kwa AI:

Zindikirani zolakwika monga kupendekera kwa solder paste, bridging, ndi malata osakwanira

Thandizani kusintha kwa kulolerana kwamphamvu (kongoletsani miyezo molingana ndi kukula kwa pad)

Kuwongolera kotseka:

Ndemanga zenizeni zenizeni kwa chosindikizira (imathandizira mitundu yodziwika bwino monga DEK ndi MPM)

Sinthani magawo monga scraper pressure ndi liwiro

Kuthamanga kwambiri komanso kulondola kwambiri:

Tekinoloje yowunikira patenti yofananira imakulitsa liwiro la kuzindikira ndi 30%

0.1μm Z-axis kusamvana

Mapangidwe osavuta kugwiritsa ntchito:

15-inchi kukhudza chophimba ntchito mawonekedwe

Thandizani pulogalamu yapaintaneti (sizimakhudza kalembedwe kake)

4. Mafotokozedwe a ntchito ndi njira zodzitetezera

Zofunikira pakuyika zida

Zofunikira za Standard

Kutentha kozungulira 20 ± 2 ℃ (msonkhano wotentha nthawi zonse)

Chinyezi cha 40-60% RH

Kugwedera kudzipatula Kugwedera matalikidwe <1μm (ndi bwino kukhazikitsa odana kugwedera ziyangoyango)

Mafotokozedwe amagetsi 220V±5%/50Hz (podziyimira pawokha <4Ω)

Zodzitetezera tsiku ndi tsiku

Njira yoyatsira:

Yambani kuyambitsa mphamvu yochitira alendo → itenthetseni kwa mphindi 10 → sinthani zokha

Gwiritsani ntchito chipika choyezera kutalika kuti mutsimikizire zolondola tsiku lililonse

Kuyika kwa PCB:

Gwiritsani ntchito vacuum adsorption kuti mukonze PCB (kuteteza kuti warping isakhudze muyeso)

Board m'mphepete mtunda kwa khoma lamkati la chipangizo ≥30mm

Kusintha kwa parameter:

Sankhani magawo osiyanasiyana owonetsera molingana ndi mtundu wa solder phala (SnPb/SAC305)

Ndikofunikira kuti muzitha kuyang'ana mawonekedwe ang'onoang'ono pama board apamwamba kwambiri

Chitetezo:

Osayang'ana mwachindunji gwero la kuwala kwa laser (Class 2M laser protection standard)

Yang'anani ntchito ya batani loyimitsa mwadzidzidzi sabata iliyonse

5. Zolakwika wamba ndi kuthetsa mavuto

Kulephera kwa Hardware

Khodi yolakwika Fault phenomenon Solution

Laser ya HW101 sinakonzekere Onani kulumikizana kwa mphamvu ya laser → Yambitsaninso chipangizocho

Kuyenda kwa HW205 Z-axis kumadutsa malire Onani makulidwe a PCB → Yeretsani nkhani yakunja panjanji yowongolera

Kulankhulana kwa kamera kwa HW308 kwalephera Kulumikizanso chingwe cha Camera Link

Kuthana ndi vuto lodziwika bwino

Deta yoyezera imasinthasintha kwambiri:

Tsukani bolodi yoyezera magalasi

Onani ngati kutentha ndi chinyezi ndizokhazikika

Blurred solder phala m'mphepete:

Sinthani mbali ya zochitika za laser (30-45 ° ndiyofunikira)

Sinthani ma parameter a lens

6. Milandu yodziwika bwino yogwiritsira ntchito

Mlandu 1: Kuzindikira kwa boardboard ya Smartphone

Zovuta:

0.3mm phula BGA solder phala kuzindikira

Pamafunika kuwongolera voliyumu mkati mwa ± 5%

Yankho:

Yambitsani mawonekedwe a micro focus scan (5μm spot diameter)

Khazikitsani gulu lololera (malo apakati ± 3%, m'mphepete ± 5%)

Mlandu 2: Kupanga ECU yamagalimoto

Zofunikira zapadera:

100% kuyang'ana kwathunthu ndi kutsata deta

Kuthamanga ≤15 masekondi / bolodi

Ndondomeko yokonzekera:

Gwiritsani ntchito ukadaulo wojambulira zowuluka (kuzindikira mosalekeza popanda kuyimitsa)

Kulumikizana mwachindunji ndi dongosolo la MES (kupanga lipoti la CPK)