SAKI BF-3Si-L2 SMT 3D SPI Machine

I-SAKI BF-3Si-L2 yinkqubo yokuhlola i-solder ye-3D ephezulu echanekileyo (SPI) eyasungulwa ngu-SAKI waseJapan, eyenzelwe ngokukodwa ukulawulwa komgangatho wenkqubo yokushicilela i-solder paste kwimigca yemveliso ye-SMT. Isixhobo sisebenzisa iteknoloji ye-imaging ye-3D ye-multi-angle ukulinganisa ngokuchanekileyo iiparameters eziphambili ezifana nobude, umthamo, kunye nommandla we-solder paste ukuqinisekisa ukuba umgangatho wokushicilela uhlangabezana neemfuno zendibano ye-elektroniki yoxinaniso oluphezulu.

Iinzuzo eziphambili:

Ukuchaneka okuphezulu kakhulu: ± 1μm ukuchaneka komlinganiselo wobude

Ukubonwa kwesantya esiphezulu: imizuzwana ye-0.03 / indawo yokuvavanya (ishishini elikhokelayo)

Ulawulo olulumkileyo oluvaliweyo: luxhasa uhlengahlengiso oluzenzekelayo lweparameter ngokudibeneyo nomshicileli

2. Iimpawu eziphambili kunye neeparitha zobugcisa

Ubumbeko lwe-Hardware

IiNkcazo zeZiqendu Iimpawu zobuGcisa

Inkqubo yokubona i-laser ene-engile ezininzi + i-high-resolution yeCCD ye-3D yokuchaneka komfanekiso ±1μm

Umthombo wokukhanya I-laser eluhlaza (405nm) + ukukhanya okumhlophe kwe-LED Nciphisa ukuphazamiseka kokubonakalisa

Inkqubo eshukumayo Imoto yomgca yokuqhuba Phinda ukuchaneka kokubeka ±3μm

Ukubona uluhlu Ubungakanani bebhodi enkulu 510×460mm Yandiswa ukuya 610×510mm

Iimpawu eziphambili zokusebenza

Izalathi zeParameters

Ubuncinci bepad yokufumanisa ubukhulu 0.1 × 0.1mm

Uluhlu lomlinganiselo wobude 0-200μm (inokwandiswa ukuya kuma-500μm)

Isantya sokubona imizuzwana eyi-0.03/inqaku lovavanyo (inqaku elilula)

Ukuchaneka komlinganiselo Ubude ±1μm, umthamo ±3%

Unxibelelwano lonxibelelwano lwe-SECS/GEM, TCP/IP, PLC I/O

3. Iinzuzo zenkqubo kunye nobuchwepheshe obutsha

Iinzuzo ezintlanu eziphambili

Imilinganiselo ye-3D eyinyani:

Itekhnoloji yokulinganisa i-multi-angle laser triangulation isetyenziselwa ukuphelisa iziphumo zesithunzi

Iyakwazi ukubona intlama ye-solder ecolekileyo (efana ne-01005 component pads)

Uhlalutyo olukrelekrele lwe-AI:

Zichonge ngokuzenzekelayo iziphene ezinje ngokuncamathela kwi-solder paste, i-bridging, kunye netoti engonelanga

Inkxaso yolungelelwaniso lonyamezelo oluguqukayo (ukwandisa ngokuzenzekelayo imigangatho ngokobungakanani bepadi)

Ulawulo oluvaliweyo:

Ingxelo yexesha lokwenyani kumshicileli (ixhasa iibrendi eziqhelekileyo ezifana neDEK kunye neMPM)

Lungisa ngokuzenzekelayo iiparamitha ezifana noxinzelelo lwe-scraper kunye nesantya

Isantya esiphezulu kunye nokuchaneka okuphezulu:

Itekhnoloji yokuskena okunxuseneyo okunelungelo elilodwa lomenzi wechiza yonyusa isantya sokubhaqa ngama-30%

0.1μm isisombululo se-Z-axis

Uyilo olusebenziseka lula:

I-15-intshi yokusebenza kwesikrini sokuchukumisa ujongano

Inkxaso yeprogram engaxhunyiwe kwi-intanethi (ayichaphazeli isingqisho semveliso)

4. Iinkcukacha zokusebenza kunye nezilumkiso

Iimfuno zofakelo lwezixhobo

Iimfuno zoMgangatho wento

Ubushushu be-Ambient yi-20±2℃ (indibano yokusebenzela yobushushu rhoqo)

Uluhlu lokufuma 40-60% RH

I-Vibration isolation ye-Vibration amplitude <1μm (kuyacetyiswa ukuba ufake i-anti-vibration pads)

Iinkcukacha zobonelelo lwamandla 220V±5%/50Hz (isiseko esizimeleyo <4Ω)

Imiqathango yokusebenza kwemihla ngemihla

Inkqubo yokuvula amandla:

Qala uqalise amandla omamkeli → fudumeza kwangaphambili kangangemizuzu eli-10 → yenza ulungelelwaniso oluzenzekelayo

Sebenzisa ibhloko yokulinganisa ubude bomgangatho ukuze uqinisekise ukuchaneka yonke imihla

Iimpawu zokubekwa kwePCB:

Sebenzisa i-vacuum adsorption ukulungisa i-PCB (ukuthintela ukulwa nokuchaphazela umlinganiselo)

Umgama webhodi yebhodi ukuya eludongeni lwangaphakathi lwesixhobo ≥30mm

Uvavanyo lweparamitha yokuseta:

Khetha iiparamitha zokubonisa ezahlukeneyo ngokohlobo lwe-solder paste (SnPb/SAC305)

Kucetyiswa ukuba uvule imowudi ye-micro-area yokuskena kwiibhodi ezinoxinano oluphezulu

Izilumkiso zokhuseleko:

Sukujonga ngqo kumthombo wokukhanya we-laser (umgangatho wokhuseleko we-laser weClass 2M)

Jonga umsebenzi weqhosha lokumisa likaxakeka rhoqo ngeveki

5. Iimpazamo eziqhelekileyo kunye nokulungisa iingxaki

Iintsilelo zehardware

Ikhowudi yempazamo Imeko yempazamo Isisombululo

I-HW101 ILaser ayilunganga Jonga uqhagamshelo lwamandla e-laser → Qalisa ngokutsha isixhobo

Intshukumo ye-HW205 Z-axis igqithe kumda Jonga isicwangciso sobunzima be-PCB → Coca umba wangaphandle kumzila wesikhokelo

HW308 Unxibelelwano lwekhamera aluphumelelanga Phinda uqhagamshelwe intambo yoQhagamshelwano lweKhamera

Indlela yokubona ingxaki yokuphatha

Idatha yomlinganiselo iguquguquka kakhulu:

Coca ibhodi yokulinganisa iglasi

Jonga ukuba ubushushu be-ambient kunye nokufuma kuzinzile

Kwincam yencama yesoda eluzizi:

Lungisa i-engile yesiganeko se-laser (30-45 ° kuyacetyiswa)

Hlaziya iiparamitha zokugxila kwilensi

6. Iimeko zesicelo eziqhelekileyo

Ityala loku-1: Ukufunyanwa kwe-motherboard ye-smartphone

Imingeni:

0.3mm pitch BGA solder ubhaqa intlama

Funa ulawulo lwevolumu ngaphakathi ±5%

Isisombululo:

Yenza imowudi yojoliso oluncinci lusebenze (5μm indawo yedayamitha)

Seta ibhendi yonyamezelo oluguqukayo (indawo esembindini ±3%, edge ±5%)

Ityala le-2: Imveliso ye-ECU yemoto

Iimfuno ezizodwa:

I-100% yokuhlolwa okupheleleyo kunye nokulandelwa kwedatha

Isantya sokubona ≤15 imizuzwana/ibhodi

Isicwangciso sophumezo:

Sebenzisa itekhnoloji yokuskena ebhabhayo (ubhaqo oluqhubekayo ngaphandle kokuma)

Uqhagamshelo oluthe ngqo kunye nenkqubo ye-MES (yenza ingxelo ye-CPK ngokuzenzekelayo)