i-ave ukuya kuthi ga kwi-70% kuMacandelo e-SMT - kwi-Stock & ukulungele ukuThunyelwa

Fumana iQuote →
product
SAKI BF-3Si-L2 SMT 3d spi machine

SAKI BF-3Si-L2 SMT 3D SPI Machine

I-SAKI BF-3Si-L2 yinkqubo yokuhlola i-solder ye-3D ephezulu echanekileyo (SPI) eyasungulwa ngu-SAKI waseJapan, eyenzelwe ngokukodwa ukulawulwa komgangatho wenkqubo yokushicilela i-solder paste kwimigca yemveliso ye-SMT.

Iinkcukacha

I-SAKI BF-3Si-L2 yinkqubo yokuhlola i-solder ye-3D ephezulu echanekileyo (SPI) eyasungulwa ngu-SAKI waseJapan, eyenzelwe ngokukodwa ukulawulwa komgangatho wenkqubo yokushicilela i-solder paste kwimigca yemveliso ye-SMT. Isixhobo sisebenzisa iteknoloji ye-imaging ye-3D ye-multi-angle ukulinganisa ngokuchanekileyo iiparameters eziphambili ezifana nobude, umthamo, kunye nommandla we-solder paste ukuqinisekisa ukuba umgangatho wokushicilela uhlangabezana neemfuno zendibano ye-elektroniki yoxinaniso oluphezulu.

Iinzuzo eziphambili:

Ukuchaneka okuphezulu kakhulu: ± 1μm ukuchaneka komlinganiselo wobude

Ukubonwa kwesantya esiphezulu: imizuzwana ye-0.03 / indawo yokuvavanya (ishishini elikhokelayo)

Ulawulo olulumkileyo oluvaliweyo: luxhasa uhlengahlengiso oluzenzekelayo lweparameter ngokudibeneyo nomshicileli

2. Iimpawu eziphambili kunye neeparitha zobugcisa

Ubumbeko lwe-Hardware

IiNkcazo zeZiqendu Iimpawu zobuGcisa

Inkqubo yokubona i-laser ene-engile ezininzi + i-high-resolution yeCCD ye-3D yokuchaneka komfanekiso ±1μm

Umthombo wokukhanya I-laser eluhlaza (405nm) + ukukhanya okumhlophe kwe-LED Nciphisa ukuphazamiseka kokubonakalisa

Inkqubo eshukumayo Imoto yomgca yokuqhuba Phinda ukuchaneka kokubeka ±3μm

Ukubona uluhlu Ubungakanani bebhodi enkulu 510×460mm Yandiswa ukuya 610×510mm

Iimpawu eziphambili zokusebenza

Izalathi zeParameters

Ubuncinci bepad yokufumanisa ubukhulu 0.1 × 0.1mm

Uluhlu lomlinganiselo wobude 0-200μm (inokwandiswa ukuya kuma-500μm)

Isantya sokubona imizuzwana eyi-0.03/inqaku lovavanyo (inqaku elilula)

Ukuchaneka komlinganiselo Ubude ±1μm, umthamo ±3%

Unxibelelwano lonxibelelwano lwe-SECS/GEM, TCP/IP, PLC I/O

3. Iinzuzo zenkqubo kunye nobuchwepheshe obutsha

Iinzuzo ezintlanu eziphambili

Imilinganiselo ye-3D eyinyani:

Itekhnoloji yokulinganisa i-multi-angle laser triangulation isetyenziselwa ukuphelisa iziphumo zesithunzi

Iyakwazi ukubona intlama ye-solder ecolekileyo (efana ne-01005 component pads)

Uhlalutyo olukrelekrele lwe-AI:

Zichonge ngokuzenzekelayo iziphene ezinje ngokuncamathela kwi-solder paste, i-bridging, kunye netoti engonelanga

Inkxaso yolungelelwaniso lonyamezelo oluguqukayo (ukwandisa ngokuzenzekelayo imigangatho ngokobungakanani bepadi)

Ulawulo oluvaliweyo:

Ingxelo yexesha lokwenyani kumshicileli (ixhasa iibrendi eziqhelekileyo ezifana neDEK kunye neMPM)

Lungisa ngokuzenzekelayo iiparamitha ezifana noxinzelelo lwe-scraper kunye nesantya

Isantya esiphezulu kunye nokuchaneka okuphezulu:

Itekhnoloji yokuskena okunxuseneyo okunelungelo elilodwa lomenzi wechiza yonyusa isantya sokubhaqa ngama-30%

0.1μm isisombululo se-Z-axis

Uyilo olusebenziseka lula:

I-15-intshi yokusebenza kwesikrini sokuchukumisa ujongano

Inkxaso yeprogram engaxhunyiwe kwi-intanethi (ayichaphazeli isingqisho semveliso)

4. Iinkcukacha zokusebenza kunye nezilumkiso

Iimfuno zofakelo lwezixhobo

Iimfuno zoMgangatho wento

Ubushushu be-Ambient yi-20±2℃ (indibano yokusebenzela yobushushu rhoqo)

Uluhlu lokufuma 40-60% RH

I-Vibration isolation ye-Vibration amplitude <1μm (kuyacetyiswa ukuba ufake i-anti-vibration pads)

Iinkcukacha zobonelelo lwamandla 220V±5%/50Hz (isiseko esizimeleyo <4Ω)

Imiqathango yokusebenza kwemihla ngemihla

Inkqubo yokuvula amandla:

Qala uqalise amandla omamkeli → fudumeza kwangaphambili kangangemizuzu eli-10 → yenza ulungelelwaniso oluzenzekelayo

Sebenzisa ibhloko yokulinganisa ubude bomgangatho ukuze uqinisekise ukuchaneka yonke imihla

Iimpawu zokubekwa kwePCB:

Sebenzisa i-vacuum adsorption ukulungisa i-PCB (ukuthintela ukulwa nokuchaphazela umlinganiselo)

Umgama webhodi yebhodi ukuya eludongeni lwangaphakathi lwesixhobo ≥30mm

Uvavanyo lweparamitha yokuseta:

Khetha iiparamitha zokubonisa ezahlukeneyo ngokohlobo lwe-solder paste (SnPb/SAC305)

Kucetyiswa ukuba uvule imowudi ye-micro-area yokuskena kwiibhodi ezinoxinano oluphezulu

Izilumkiso zokhuseleko:

Sukujonga ngqo kumthombo wokukhanya we-laser (umgangatho wokhuseleko we-laser weClass 2M)

Jonga umsebenzi weqhosha lokumisa likaxakeka rhoqo ngeveki

5. Iimpazamo eziqhelekileyo kunye nokulungisa iingxaki

Iintsilelo zehardware

Ikhowudi yempazamo Imeko yempazamo Isisombululo

I-HW101 ILaser ayilunganga Jonga uqhagamshelo lwamandla e-laser → Qalisa ngokutsha isixhobo

Intshukumo ye-HW205 Z-axis igqithe kumda Jonga isicwangciso sobunzima be-PCB → Coca umba wangaphandle kumzila wesikhokelo

HW308 Unxibelelwano lwekhamera aluphumelelanga Phinda uqhagamshelwe intambo yoQhagamshelwano lweKhamera

Indlela yokubona ingxaki yokuphatha

Idatha yomlinganiselo iguquguquka kakhulu:

Coca ibhodi yokulinganisa iglasi

Jonga ukuba ubushushu be-ambient kunye nokufuma kuzinzile

Kwincam yencama yesoda eluzizi:

Lungisa i-engile yesiganeko se-laser (30-45 ° kuyacetyiswa)

Hlaziya iiparamitha zokugxila kwilensi

6. Iimeko zesicelo eziqhelekileyo

Ityala loku-1: Ukufunyanwa kwe-motherboard ye-smartphone

Imingeni:

0.3mm pitch BGA solder ubhaqa intlama

Funa ulawulo lwevolumu ngaphakathi ±5%

Isisombululo:

Yenza imowudi yojoliso oluncinci lusebenze (5μm indawo yedayamitha)

Seta ibhendi yonyamezelo oluguqukayo (indawo esembindini ±3%, edge ±5%)

Ityala le-2: Imveliso ye-ECU yemoto

Iimfuno ezizodwa:

I-100% yokuhlolwa okupheleleyo kunye nokulandelwa kwedatha

Isantya sokubona ≤15 imizuzwana/ibhodi

Isicwangciso sophumezo:

Sebenzisa itekhnoloji yokuskena ebhabhayo (ubhaqo oluqhubekayo ngaphandle kokuma)

Uqhagamshelo oluthe ngqo kunye nenkqubo ye-MES (yenza ingxelo ye-CPK ngokuzenzekelayo)

微信图片_20250531224832


Kutheni abantu abaninzi bekhetha ukusebenza ngeGeekValue?

Uphawu lwethu lusasazeka ukusuka kwisixeko ukuya kwisixeko, kwaye abantu abangenakubalwa bandibuze, "Yintoni iGeekValue?" Ivela kumbono olula: ukuxhobisa ukuqalwa kweTshayina ngetekhnoloji yokusika. Lo ngumoya wokuziphucula okuqhubekayo, ofihliweyo ekusukeleni kwethu iinkcukacha ezingayekiyo kunye nolonwabo lokugqithisa ebesikulindele ngalo lonke unikezelo. Obu buchule bobugcisa obuphantse bugqithise kunye nokuzinikela akukona nje ukuzingisa kwabaseki bethu, kodwa kunye nokubaluleka kunye nokufudumala kwe-brand yethu. Siyathemba ukuba uza kuqala apha kwaye usinike ithuba lokudala imfezeko. Masisebenze kunye ukwenza ummangaliso olandelayo othi "zero defect".

Iinkcukacha
GEEKVALUE

I-Geekvalue: Uzalelwe oomatshini bokuKhetha-neNdawo

Inkokeli yesisombululo esinye sokumisa i-chip mounter

Ngathi

Njengomthengisi wezixhobo kushishino lokwenziwa kombane, iGeekvalue ibonelela ngoluhlu loomatshini abatsha nabasele besetyenzisiwe kunye nezixhobo ezisuka kwiibrendi ezaziwayo ngamaxabiso akhuphisana kakhulu.

Idilesi yoqhagamshelwano:No. 18, Shangliao Industrial Road, Shajing Town, Baoan District, Shenzhen, China

Inombolo yefowuni yokubonisana:+86 13823218491

I-imeyile:smt-sales9@gdxinling.cn

QHAGAMSHELANA NATHI

© Onke Amalungelo Agciniwe. Inkxaso yobuGcisa:TiaoQingCMS

kfweixin

Skena ukongeza i-WeChat