Ekyuma kya SAKI BF-3Si-L2 SMT 3D SPI

SAKI BF-3Si-L2 ye nkola ey’okukebera solder paste mu ngeri ya 3D (SPI) eyatongozebwa kkampuni ya SAKI eya Japan, eyakolebwa mu ngeri ey’enjawulo okulondoola omutindo gw’enkola y’okukuba solder paste ku layini z’okufulumya SMT. Ekyuma kino kikozesa tekinologiya wa multi-angle 3D imaging okupima obulungi ebikulu ng’obugulumivu, obuzito, n’ekitundu kya solder paste okukakasa nti omutindo gw’okukuba ebitabo gutuukana n’ebyetaago by’okukuŋŋaanya ebyuma eby’amaanyi.

Ebirungi ebikulu:

Ultra-high precision: ±1μm obuwanvu okupima obutuufu

Okuzuula ku sipiidi ey’amaanyi: sekondi 0.03/ekifo eky’okugezesa (ekikulembedde amakolero)

Intelligent closed-loop control: ewagira okutereeza parameter okw'otoma nga kukwataganye ne printer

2. Ebikulu ebikwata ku nsonga n’ebipimo by’ebyekikugu

Ensengeka ya Hardware

Ebitundu Ebikwata ku bitundu Ebikwata ku by’ekikugu

Enkola y’amaaso Okusika kwa layisi okw’enkoona eziwera + obutuufu bw’okukuba ebifaananyi mu CCD 3D mu ngeri ey’obulungi ennyo ±1μm

Ensibuko y’ekitangaala Layisi ya bbululu (405nm) + ekitangaala ekyeru LED Okukendeeza ku kutaataaganyizibwa kw’okutunula

Enkola y’entambula Linear motor drive Ddamu obutuufu bw’okuteeka mu kifo ±3μm

Ekifo eky’okuzuula Sayizi ya bboodi esinga obunene 510×460mm Egaziwa okutuuka ku 610×510mm

Ebikulu ebiraga enkola y’emirimu

Ebiraga Parameters

Sayizi ya paadi y’okuzuula esinga obutono 0.1×0.1mm

Obugulumivu bw’okupima 0-200μm (buyinza okugaziwa okutuuka ku 500μm)

Sipiidi y’okuzuula 0.03 sekondi/ekifo eky’okugezesa (ekintu eky’angu)

Obutuufu bw’okupima Obugulumivu ±1μm, obuzito ±3%

Enkolagana y'empuliziganya SECS/GEM, TCP/IP, PLC I/O

3. Ebirungi by’enkola ne tekinologiya omuyiiya

Ebirungi bitaano ebikulu

Ekipimo ekituufu ekya 3D:

Tekinologiya w’okupima enjuyi essatu (multi-angle laser triangulation measurement) akozesebwa okumalawo ebikosa ebisiikirize

Asobola okuzuula ekikuta kya solder eky’amaanyi (nga 01005 component pads) .

Okwekenenya okw’amagezi kwa AI:

Laba otomatiki ebikyamu nga solder paste tipping, bridging, ne tin obutamala

Okuwagira okutereeza okugumiikiriza okw’amaanyi (okulongoosa omutindo mu ngeri ey’otoma okusinziira ku sayizi ya paadi)

Okufuga okw’olukoba oluggaddwa:

Okuddamu kwa data mu kiseera ekituufu eri printer (ewagira ebika ebikulu nga DEK ne MPM)

Teekateeka mu ngeri ey’otoma parameters nga scraper pressure ne speed

Sipiidi ya waggulu n’obutuufu obw’amaanyi:

Tekinologiya wa patented parallel scanning ayongera ku sipiidi y’okuzuula ebitundu 30%

0.1μm Z-ekisiki okusalawo

Dizayini enyangu okukozesa:

Enkola y’okukola ku touch screen ya yinsi 15

Okuwagira pulogulaamu ezitali ku mutimbagano (tezikosa nnyimba za kukola)

4. Ebikwata ku nkola n’okwegendereza

Ebyetaago by’okuteeka ebyuma

Ebyetaago bya Item Standard

Ebbugumu ly’ekifo 20±2°C (omusomo gw’ebbugumu buli kiseera)

Obunnyogovu buba 40-60% RH

Okwawula okukankana Amplitude y’okukankana <1μm (kirungi okuteeka paadi eziziyiza okukankana)

Ebikwata ku masannyalaze 220V±5%/50Hz (okussa ku ttaka okwetongodde <4Ω)

Okwegendereza mu kulongoosa buli lunaku

Enkola y’okussaako amasannyalaze:

Sooka otandike amaanyi ga host → preheat okumala eddakiika 10 → kola automatic calibration

Kozesa standard height calibration block okukakasa obutuufu buli lunaku

Ebikwata ku kuteeka PCB:

Kozesa vacuum adsorption okutereeza PCB (okuziyiza warping okukosa okupima) .

Board edge distance okutuuka ku bbugwe ow’omunda ow’ekyuma ≥30mm

Okuteekawo parameter y'okuzuula:

Londa ebipimo eby’enjawulo eby’okutunula okusinziira ku kika kya solder paste (SnPb/SAC305) .

Kirungi okusobozesa enkola ya micro-area scanning mode ku boards ezirina density enkulu

Okwegendereza mu by’okwerinda:

Totunuulira butereevu nsibuko ya kitangaala kya layisi (Class 2M laser protection standard) .

Kebera omulimu gwa button y’okuyimirira mu bwangu buli wiiki

5. Ensobi ezitera okubaawo n’okugonjoola ebizibu

Okulemererwa kwa Hardware

Koodi y’ensobi Ekintu ekirabika eky’ensobi Ekigonjoolwa

HW101 Layisi si yeetegese Kebera okuyungibwa kw’amasannyalaze ga layisi → Ddamu okutandika ekyuma

HW205 Entambula ya Z-axis esukka ekkomo Kebera ensengeka y’obuwanvu bwa PCB → Yoza ebintu ebigwira ku ggaali y’omukka elungamya

HW308 Empuliziganya ya kamera eremereddwa Ddamu ssaako waya ya Camera Link

Enkola eya bulijjo ey’okukwata ebizibu by’okuzuula

Ebiwandiiko ebipima bikyukakyuka nnyo:

Okwoza olubaawo lw’okupima endabirwamu

Kebera oba ebbugumu n’obunnyogovu bw’ekifo bibeera binywevu

Empenda ya solder paste etali nnungi:

Teekateeka enkoona y’okugwa kwa layisi (30-45° kirungi)

Okulongoosa ebipimo by’okussa essira ku lenzi

6. Emisango egya bulijjo egy’okusaba

Omusango 1: Okuzuula motherboard y’essimu ey’omu ngalo

Okusoomoozebwa:

0.3mm pitch BGA solder paste okuzuula

Yeetaaga okufuga eddoboozi mu ±5% .

Okugonjoola:

Ssobozesa enkola ya micro focus scanning (5μm spot diameter) .

Teekawo bbandi y’okugumiikiriza okw’amaanyi (ekitundu wakati ±3%, ku mabbali ±5%)

Omusango 2: Okukola ECU z’emmotoka

Ebyetaago eby’enjawulo:

100% okwekebejja mu bujjuvu n'okulondoola data

Sipiidi y’okuzuula ≤15 seconds/board

Enteekateeka y’okussa mu nkola:

Kozesa tekinologiya wa sikaani ezibuuka (okuzuula obutasalako nga toyimiridde) .

Okuyungibwa obutereevu n'enkola ya MES (okukola lipoota ya CPK mu ngeri ey'otoma)