SAKI BF-3Si-L2 SMT 3D SPI Imashini

SAKI BF-3Si-L2 ni sisitemu yo kugenzura neza ya 3D igurisha ibicuruzwa (SPI) yatangijwe na SAKI yo mu Buyapani, ikaba yarakozwe mu buryo bwihariye bwo kugenzura ubuziranenge bw’ibicuruzwa byacapishijwe ku murongo wa SMT. Ibikoresho bifashisha tekinoroji ya 3D yerekana amashusho kugirango bapime neza ibipimo byingenzi nkuburebure, ingano, hamwe nubuso bwa paste kugurisha kugirango barebe ko icapiro ryujuje ibisabwa byiteranirizo rya elegitoroniki.

Ibyiza byingenzi:

Ultra-high precision: ± 1μm uburebure bwo gupima neza

Kumenyekanisha byihuse: amasegonda 0.03 / ikizamini (inganda ziyobora)

Intelligent ifunze-loop igenzura: ishyigikira ibipimo byikora byikora hamwe na printer

2. Ibyingenzi byingenzi nibipimo bya tekiniki

Ibikoresho

Ibigize Ibisobanuro Ibiranga tekinike

Sisitemu ya optique Multi-angle laser scanning + iremereye cyane CCD 3D yerekana amashusho ± 1μm

Inkomoko yumucyo Lazeri yubururu (405nm) + itara ryera LED Kugabanya kwivanga

Sisitemu yimodoka Imodoka itwara umurongo Subiramo umwanya uhagaze ± 3μm

Urutonde rwo gutahura Ingano ntarengwa ya 510 × 460mm Yaguka kuri 610 × 510mm

Ibipimo ngenderwaho byingenzi

Ibipimo byerekana ibipimo

Ingano ntoya yo gutahura 0.1 × 0.1mm

Uburebure bwa metero 0-200μm (bwaguka kuri 500 mm)

Kumenya umuvuduko amasegonda 0.03 / ingingo yikizamini (ibintu byoroshye)

Ibipimo bifatika Uburebure ± 1μm, ubunini ± 3%

Imigaragarire y'itumanaho SECS / GEM, TCP / IP, PLC I / O.

3. Ibyiza bya sisitemu nubuhanga bushya

Ibyiza bitanu byingenzi

Ibipimo nyabyo bya 3D:

Ikoreshwa rya tekinoroji ya Multi-angle laser triangulation ikoreshwa mugukuraho ingaruka zigicucu

Irashobora gutahura neza neza kugurisha paste (nka 01005 yamashanyarazi)

Isesengura ryubwenge bwa AI:

Mu buryo bwikora menya inenge nko kugurisha paste kugurisha, kuraro, n'amabati adahagije

Shyigikira imbaraga zo kwihanganira imbaraga (guhita utezimbere ibipimo ukurikije ubunini bwa padi)

Igenzura rifunze:

Ibihe-byukuri byamakuru kuri printer (ishyigikira ibirango byingenzi nka DEK na MPM)

Hindura uhindure ibipimo nkumuvuduko wa scraper n'umuvuduko

Umuvuduko mwinshi kandi wuzuye:

Tekinoroji ya parallel yogusikana yongera umuvuduko wo gutahura 30%

0.1μm Z-axis ikemurwa

Igishushanyo-cy'abakoresha:

Imigaragarire ya santimetero 15

Shyigikira gahunda yo kumurongo (ntabwo bigira ingaruka kumusaruro)

4. Ibisobanuro n'ibikorwa byo kwirinda

Ibisabwa byo kwishyiriraho ibikoresho

Ikintu gisanzwe gisabwa

Ubushyuhe bwibidukikije 20 ± 2 ℃ (amahugurwa yubushyuhe burigihe)

Ubushuhe buri hagati ya 40-60% RH

Vibration kwigunga Vibration amplitude <1μm (birasabwa gushiraho padi anti-vibration)

Ibisobanuro by'amashanyarazi 220V ± 5% / 50Hz (kwigenga kwigenga <4Ω)

Ibikorwa bya buri munsi

Uburyo bwo gukoresha ingufu:

Banza utangire imbaraga zo kwakira → shyushya iminota 10 → kora kalibrasi yikora

Koresha uburebure busanzwe bwa kalibrasi kugirango ugenzure neza buri munsi

Ibisobanuro bya PCB:

Koresha vacuum adsorption kugirango ukosore PCB (kugirango wirinde kurwara bigira ingaruka kubipimo)

Intera yimbere kugeza kurukuta rwimbere rwigikoresho ≥30mm

Igenamiterere ryerekana:

Hitamo ibipimo bitandukanye byerekana ukurikije ubwoko bwa paste paste (SnPb / SAC305)

Birasabwa gushoboza micro-agace yogusikana kuburyo bwimbitse

Uburyo bwo kwirinda umutekano:

Ntukarebe neza urumuri rutanga urumuri (Icyiciro cya 2M cyo kurinda laser)

Reba imikorere yo guhagarika byihutirwa buri cyumweru

5. Amakosa asanzwe no gukemura ibibazo

Kunanirwa kw'ibyuma

Ikosa ry'amakosa Ikibazo gikemutse

HW101 Laser ntabwo yiteguye Reba amashanyarazi ya laser → Ongera utangire igikoresho

HW205 Z-axis irenze imipaka Reba ubugari bwa PCB → Sukura ibintu byamahanga kuri gari ya moshi.

HW308 Itumanaho rya Kamera ryananiwe Gusubiramo umugozi wa Kamera

Gukemura ikibazo gisanzwe

Ibipimo byo gupima bihindagurika cyane:

Sukura ikibaho cya kalibibasi

Reba niba ubushyuhe bwibidukikije nubushuhe bihamye

Kugurisha ibicuruzwa bitameze neza:

Hindura inguni yibyabaye (30-45 ° birasabwa)

Kuvugurura lens yibanze

6. Imanza zisanzwe zo gusaba

Ikiburanwa 1: Kumenyekanisha ububiko bwa terefone

Inzitizi:

0.3mm ikibanza BGA igurisha paste

Saba kugenzura amajwi muri ± 5%

Igisubizo:

Gushoboza micro yibanze yo gusikana (diameter 5mm)

Shiraho imbaraga zo kwihanganira imbaraga (agace hagati ± 3%, inkombe ± 5%)

Ikiburanwa cya 2: Imodoka ya ECU umusaruro

Ibisabwa bidasanzwe:

100% igenzura ryuzuye hamwe namakuru akurikirana

Kumenya umuvuduko ≤ amasegonda 15 / ikibaho

Gahunda yo kuyishyira mu bikorwa:

Koresha tekinoroji yo kuguruka (guhora ushishoza udahagarara)

Ihuza ritaziguye na sisitemu ya MES (ihita itanga raporo ya CPK)