SAKI smt 3D SPI machine 3Si-LS3EX

SAKI 3Si-LS3EX is the latest high-end 3D solder paste inspection system (SPI) launched by SAKI of Japan. It adopts multi-spectral confocal imaging technology and is designed to meet the ultra-precision solder paste inspection requirements such as 01005 components and 0.3mm pitch BGA. Compared with the previous generation 3Si-L2, LS3EX has significantly improved the inspection speed, accuracy and intelligence.

Typical application scenarios

Miniaturized electronics: smart watch motherboard, TWS headset circuit board

High reliability field: automotive ADAS module, medical implant device PCB

Advanced packaging: Fan-out packaging, 2.5D/3D IC substrate

2. Technical specifications and hardware configuration

Core hardware parameters

Subsystem Technical specifications Technical highlights

Optical system 7-wavelength confocal imaging (405-940nm) Eliminate metal reflection interference

Z-axis measurement White light interferometer assisted 0.05μm resolution

Motion platform Magnetic suspension drive Acceleration 2G, repeatability ±1μm

Detection range 510×460mm standard version Optional 610×510mm large size

Key performance indicators

Parameters Indicators Test conditions

Height accuracy ±0.5μm 50μm standard step

Volume accuracy ±2% IPC-7527 standard

Minimum detection size 30×30μm 01005 component pad

Maximum scanning speed 1.8m/s Simple graphics mode

Detection cycle <8 seconds/board 300×200mm board

3. Core functions and technological innovation

Revolutionary detection technology

SmartFocus 3.0 technology

Dyamic focus compensation to solve the measurement error caused by PCB warpage

Adaptable to 0.1-1.2mm board thickness change

AI solder paste prediction engine

Predict the shape after reflow soldering (simulate thermal deformation process)

Identify potential bridging/false soldering risks in advance

Multi-process compatible mode

Process type Detection mode

Ordinary SMT Fast scanning mode

Precision packaging High resolution mode (5μm step)

Thick copper PCB Infrared compensation mode

Intelligent software function

Real-time 3D modeling:

Solder paste 3D model example

(Figure: Solder paste volume distribution heat map)

Closed-loop feedback system architecture:

Chart

Code

4. Operating specifications and safety precautions

Standard operating procedures

Preheating before powering on

The laser system needs to be preheated for 15 minutes (extended to 20 minutes when the ambient temperature is <25℃)

Daily calibration

Use the NIST traceable calibration board to execute:

python

def daily_calibration():

if not calibrate_height(standard=50μm):

alert("Z-axis calibration abnormal")

run_flatness_check()

Detection parameter settings

Solder paste type Recommended parameters

SAC305 Wavelength combination: blue + infrared

SnPb Wavelength combination: green + red

Conductive adhesive Special mode M7

Key safety specifications

Laser safety:

It is forbidden to open the protective cover when the equipment is running (in accordance with IEC 60825-1 Class 1M standard)

Special laser protective glasses must be worn during maintenance

Electrical safety:

Check the ground resistance every week (need to be <3Ω)

After a sudden power failure, it is necessary to restart after an interval of 5 minutes

5. Common fault diagnosis and solutions

Hardware faults

Error code Fault phenomenon Processing steps Tool requirements

E701 Laser power attenuation 1. Clean the fiber connector

2. Perform power calibration Optical power meter

E808 Platform vibration exceeds the standard 1. Check the air floating foot pressure

2. Isolate the surrounding vibration source Vibration analyzer

Software failure

Error message Root cause Solution

"AI model loading failed" Insufficient GPU video memory 1. Upgrade the driver

2. Simplify the detection area

"Data storage conflict" Database index is damaged Execute DB_REBUILD command

Typical process problem handling

Solder paste edge jagged:

matlab

% Optimization solution:

if jaggedness > 0.2μm

Adjust scanning speed = current speed × 0.8;

Increase the number of sampling points;

end

Poor measurement repeatability:

Check the environmental temperature and humidity fluctuations (should be <±1℃/h)

Recalibrate the platform level (need <0.01mm/m)

X/Y axis grating scale calibration (requires a dedicated interferometer)

Laser output spectrum detection

Every two years:

Replace the shockproof rubber pad

Inspect the air path sealing of the whole machine

7. Analysis of industry application cases

Case 1: Production of micro medical devices

Challenges:

0.15mm diameter pad detection

Require 100% zero defects

Solution:

Enable ultra-high resolution mode (3μm/pixel)

Set 3D shape tolerance band

Case 2: Automotive radar module

Special needs:

Detect embedded solder joints

Upload data to QMS system

Implementation plan:

Use tilt scanning technology (maximum 15°)

Develop customized data interface