SAKI smt ekyuma kya 3D SPI 3Si-LS3EX

SAKI 3Si-LS3EX ye nkola ya 3D ey’omulembe ey’okukebera solder paste (SPI) eyatongozebwa kkampuni ya SAKI eya Japan. Ekozesa tekinologiya wa multi-spectral confocal imaging era nga ekoleddwa okutuukiriza ebisaanyizo by’okukebera solder paste mu ngeri ey’obulungi ennyo nga ebitundu 01005 ne 0.3mm pitch BGA. Bw’ogeraageranya n’omulembe ogwa 3Si-L2, LS3EX eyongedde nnyo ku sipiidi y’okukebera, obutuufu n’amagezi.

Ensonga eza bulijjo ez’okukozesa

Ebyuma ebitonotono: motherboard y’essaawa entegefu, circuit board ya TWS headset

Ennimiro ey’obwesigwa obw’amaanyi: modulo ya ADAS ey’emmotoka, ekyuma ekiteekebwa mu mubiri eky’obujjanjabi PCB

Okupakinga okw’omulembe: Okupakinga okuva mu ffaani, 2.5D/3D IC substrate

2. Ebikwata ku by’ekikugu n’ensengeka ya hardware

Ebipimo bya hardware ebikulu

Subsystem Ebikwata ku by’ekikugu Ebikulu mu by’ekikugu

Enkola y’amaaso 7-wavelength confocal imaging (405-940nm) Ggyawo okutaataaganyizibwa kw’okutunula kw’ebyuma

Okupima Z-axis Ekipima ekiziyiza ekitangaala ekyeru kiyambibwako 0.05μm okusalawo

Entambula platform Magnetic suspension drive Yanguwa 2G, okuddiŋŋana ±1μm

Obunene bw’okuzuula 510×460mm standard version Okwesalirawo 610×510mm sayizi ennene

Ebikulu ebiraga enkola y’emirimu

Ebipimo Ebiraga Embeera z’okugezesa

Obutuufu bw’obugulumivu ±0.5μm 50μm omutendera ogw’omutindo

Obutuufu bw’obunene ±2% IPC-7527 omutindo

Sayizi y’okuzuula esinga obutono 30×30μm 01005 component pad

Sipiidi esinga obunene ey’okusika 1.8m/s Simple graphics mode

Enzirukanya y'okuzuula

3. Emirimu emikulu n’obuyiiya mu tekinologiya

Tekinologiya ow’enkyukakyuka mu kuzuula

Tekinologiya wa SmartFocus 3.0

Dyamic focus compensation okugonjoola ensobi y’okupima ereetebwa PCB warpage

Ekyukakyuka ku 0.1-1.2mm obuwanvu bw’olubaawo

AI solder paste yingini etegeeza

Lagula enkula oluvannyuma lw’okusoda mu kuddamu okukulukuta (okukoppa enkola y’okukyusakyusa ebbugumu) .

Laba obulabe obuyinza okuva mu kukola bridge/false soldering nga bukyali

Mode ekwatagana n’enkola eziwera

Ekika ky’enkola Enkola y’okuzuula

SMT eya bulijjo Mode ya sikaani ey’amangu

Okupakinga okutuufu Mode ya high resolution (5μm step) .

Ekikomo ekinene PCB Infrared compensation mode

Omulimu gwa pulogulaamu ogw’amagezi

Okukola ebifaananyi mu kiseera ekituufu mu 3D:

Solder paste 3D model ekyokulabirako

(Ekifaananyi: Maapu y’ebbugumu ly’okugabanya obuzito bwa solder paste)

Enzimba y’enkola y’okuddamu ey’olukoba oluggaddwa:

Ekipande

Koodi

4. Ebikwata ku nkola y’emirimu n’okwegendereza mu by’okwerinda

Enkola z’emirimu eza mutindo

Okusooka okubugumya nga tonnaba kussaako masannyalaze

Enkola ya layisi yeetaaga okusooka okubuguma okumala eddakiika 15 (nga eyongezeddwayo okutuuka ku ddakiika 20 ng’ebbugumu ly’ekifo liri <25°C) .

Okupima buli lunaku

Kozesa olubaawo lw'okupima olulondoolebwa NIST okukola:

python omusajja

def buli lunaku_okupima ():

bwe kiba nga si calibrate_height (omutindo = 50μm):

alert ("Okupima kwa Z-ekisiki si kwa bulijjo")

run_flatness_okukebera () .

Ensengeka za parameter y'okuzuula

Solder paste type Ebipimo ebisemba

SAC305 Omugatte gw’obuwanvu bw’amayengo: bbululu + infrared

SnPb Omugatte gw’obuwanvu bw’amayengo: kiragala + emmyufu

Ekyesiiga ekitambuza amazzi Mode ey’enjawulo M7

Ebikulu ebikwata ku byokwerinda

Obukuumi bwa layisi:

Kigaaniddwa okuggulawo ekibikka eky’obukuumi ng’ebyuma bikola (okusinziira ku mutindo gwa IEC 60825-1 Class 1M)

Endabirwamu ez’enjawulo ezikuuma layisi zirina okwambalibwa nga ziddaabiriza

Obukuumi bw’amasannyalaze:

Kebera obuziyiza bw’ettaka buli wiiki (kyetaaga okuba <3Ω)

Oluvannyuma lw’amasannyalaze okugwa mu bwangu, kyetaagisa okuddamu okutandika oluvannyuma lw’okumala eddakiika 5

5. Okuzuula ensobi eza bulijjo n’okuzigonjoola

Ensobi mu Hardware

Error code Fault phenomenon Emitendera gy’okukola Ebyetaago by’ebikozesebwa

E701 Okukendeeza ku maanyi ga layisi 1. Yoza ekiyungo kya fiber

2. Kola okupima amaanyi Optical power meter

E808 Okukankana kwa pulatifomu kusukka omutindo 1. Kebera puleesa y’ebigere ebitengejja empewo

2. Yawula ensibuko y’okukankana eyeetoolodde Vibration analyzer

Sofutiweya okulemererwa

Obubaka bw'ensobi Ekikolo ekivaako Ekigonjoola

"Okutikka model ya AI kulemereddwa" Memory ya vidiyo ya GPU etamala 1. Upgrade driver

2. Yanguyiza ekifo eky’okuzuula

"Okukontana mu kutereka data" Omuwendo gwa database gwonoonese Kola ekiragiro DB_REBUILD

Enkola eyabulijjo okukwata ebizibu

Solder paste edge eriko amajaani:

matlab

% Ekigonjoola okulongoosa:

singa obuwanvu bwa jagged > 0.2μm

Teekateeka sipiidi ya sikaani = sipiidi eriwo kati × 0.8;

Okwongera ku muwendo gw’ebifo eby’okutwala sampuli;

enkomerero

Obubi okuddiŋŋana okupima:

Kebera enkyukakyuka z’ebbugumu n’obunnyogovu mu butonde (zirina okuba <±1°C/h) .

Ddamu okupima omutindo gwa pulatifomu (obwetaavu <0.01mm/m)

X/Y axis grating scale calibration (kyetaagisa ekipima ekiziyiza ekyetongodde) .

Okuzuula ensengekera y’ebifulumizibwa mu layisi

Buli luvannyuma lwa myaka ebiri:

Kikyuseemu paadi ya kapiira etakubwa

Kebera okusiba ekkubo ly’empewo ery’ekyuma kyonna

7. Okwekenenya emisango gy’okusaba mu makolero

Omusango 1: Okukola ebyuma ebitonotono eby’obujjanjabi

Okusoomoozebwa:

0.15mm diameter pad okuzuula

Yeetaaga 100% zero defects

Okugonjoola:

Ssobozesa enkola ya ultra-high resolution (3μm/pixel) .

Teekawo bbandi y’okugumiikiriza ekifaananyi kya 3D

Omusango 2: Module ya rada y’emmotoka

Ebyetaago eby’enjawulo:

Zuula ebiyungo bya solder ebiteekeddwamu

Teeka data ku nkola ya QMS

Enteekateeka y’okussa mu nkola:

Kozesa tekinologiya wa tilt scanning (ekisinga obunene 15°) .

Okukola enkola ya data erongooseddwa