SAKI 3Si-LS3EX waa nidaamka kormeerka koollada 3D-dhamaadka sare ee ugu dambeeyay (SPI) oo uu bilaabay SAKI ee Japan. Waxay qabataa tignoolajiyada sawirka konfocal-ka-muuqaalka badan waxaana loogu talagalay inay buuxiso shuruudaha kormeerka koollada alxanka ee aadka u saxda ah sida qaybaha 01005 iyo 0.3mm garoonka BGA. Marka la barbar dhigo jiilkii hore ee 3Si-L2, LS3EX waxay si weyn u hagaajisay xawaaraha kormeerka, saxnaanta iyo garaadka.
Xaaladaha codsiga caadiga ah
Elektrooniga oo la yareeyey: Motherboard smart watch, guddiga madaxa madaxa ee TWS
Goobta isku halaynta sare: module ADAS baabuurta, PCB qalab galinta caafimaadka
Baakadaha horumarsan: Baakadaha Fan-out, 2.5D/3D IC substrate
2. Tilmaamaha farsamada iyo qaabeynta qalabka
Halbeegyada qalabka muhiimka ah
Nidaam hoosaadka Tilmaamaha Farsamada Qodobbada Farsamada
Nidaamka indhaha 7-mawjadaha konfocal imaging (405-940nm) Tirtir faragelinta biraha
Cabbirka dhidibka Z interferometer-ka cad wuxuu caawiyay xallinta 0.05μm
Madal dhaqdhaqaaqa Magnetic joojinta wadista dardargelinta 2G, ku celcelintu ± 1μm
Kala duwanaanshaha ogaanshaha 510 × 460mm nooca caadiga ah ee ikhtiyaarka ah 610 × 510mm cabbir weyn
Tilmaamayaasha waxqabadka muhiimka ah
Tilmaamayaasha Halbeegyada Tijaabada xaaladaha
Saxnaanta dhererka ± 0.5μm 50μm tallaabada caadiga ah
Saxnaanta mugga ± 2% IPC-7527 heerka
Cabbirka ogaanshaha ugu yar 30 × 30μm 01005 suufka ka kooban
Xawaaraha ugu badan ee iskaanka 1.8m/s Qaab sawiro fudud
Wareegga ogaanshaha <8 seconds/board 300×200mm looxa
3. Hawlaha asaasiga ah iyo hal-abuurka tignoolajiyada
Farsamada ogaanshaha kacaanka
Tignoolajiyada SmartFocus 3.0
Magdhawga diirada durugsan leh si loo xalliyo khaladka cabbiraadda ee uu sababay bogga dagaal ee PCB
La qabsan kara 0.1-1.2mm dhumucda guddiga isbeddelka
Matoorka saadaasha koollada AI
Saadaali qaabka ka dib alxanka dib u qulqulaya (ku ekay habka qallafsanaanta kulaylka)
Horey u sii ogow khataraha wax iibinta ee iman kara
Habka ku habboon nidaamka badan
Nooca habka loo ogaado qaabka
Habka iskaanka degdega ah ee SMT caadiga ah
Baakadaha saxda ah Habka xallinta sare (tallaabo 5μm)
Qaabka magdhowga infrared ee PCB naxaasta ah
Shaqada software garaadka
Qaabaynta 3D ee wakhtiga-dhabta ah:
Alxanka koollada 3D tusaale ahaan
(Jaantuska: Khariidadda kulaylka qaybinta mugga koodhka alxanka)
Qaab dhismeedka nidaamka jawaab celinta xidh-xidhan:
Shaxda
Koodhka
4. Tilmaamaha hawlgalka iyo taxaddarrada badbaadada
Hababka hawlgalka caadiga ah
Kuleyl ka hor inta aan la shidin
Nidaamka laysarka wuxuu u baahan yahay in la sii kululeeyo 15 daqiiqo (la kordhiyo ilaa 20 daqiiqo marka heerkulka deegaanku yahay <25℃)
Habaynta maalinlaha ah
Adeegso guddiga cabirka raadraaca ee NIST si aad ufuliso:
Python
iska dhaaf daily_calibration():
hadaysan ahayn calibrate_height (standard=50μm):
feejignaan ("dhidibka Z-axis aan caadi ahayn")
jeeg_gudbi_la'aan()
Dejinta halbeegga ogaanshaha
Nooca koollada alxanka ee lagu taliyay
SAC305 Mawjada dhererka isku dhafka: buluug + infrared
Isku darka mawjada dhererka ee SnPb: cagaar + casaan
Xabagta wax qabad ee Qaabka gaarka ah M7
Tilmaamaha badbaadada muhiimka ah
Badbaadada laser:
Waa mamnuuc in la furo daboolka ilaalinta marka qalabku socdo (sida waafaqsan heerka IEC 60825-1 Class 1M)
Muraayadaha ilaalinta laysarka ee gaarka ah waa in la xidho inta lagu jiro dayactirka
Badbaadada korantada:
Hubi iska caabinta dhulka toddobaad kasta (waxay u baahan tahay inay noqoto <3Ω)
Kadib cilad degdeg ah oo koronto ah, waxaa lagama maarmaan ah in dib loo bilaabo ka dib 5 daqiiqo gudahood
5. Cilad-sheegid guud iyo xalal
Cilladaha qalabka
Nambarka khaladka ifafaale qaladka Habaynta tillaabooyinka loo baahan yahay qalabka
E701 Laysarka oo yaraada 1. Nadiifi xiriiriyaha fiber-ka
2. Samee cabirka awoodda mitirka korantada indhaha
Gariirka E808 Platform wuxuu ka sarreeyaa heerka caadiga ah 1. Hubi cadaadiska cagta ee hawada sabaynaya
2. Kala saar isha gariir ee ku xeeran falanqeeyaha gariir
Guuldarada software
Fariinta khaladka ah ee Xididka Xalka
"Model AI loading wuu guuldarreystay" Xusuusta muuqaalka GPU oo aan ku filnayn 1. Kor u qaad darawalka
2. Fududeeya aagga ogaanshaha
"Khilaafka kaydinta xogta" Tusmada kaydka xogta ayaa dhaawacday Fulin amarka DB_REBUILD
Maareynta dhibka habka caadiga ah
Alxanka cidhifka ah ayaa jabay:
matlab
% Xalka hagaajinta:
haddii jaggedness> 0.2μm
Hagaajin xawaaraha iskaanka = xawaaraha hadda × 0.8;
Kordhi tirada dhibcaha saamiga;
dhamaad
Dib-u-celinta qiyaasta liidata:
Hubi heerkulka deegaanka iyo isbedbedelka qoyaanka (waa inay ahaadaan <±1℃/saacaddii)
Dib u habeyn heerka goobta (baahi <0.01mm/m)
Qiyaasta cabbirka dhidibka X/Y (waxay u baahan tahay interferometer gaar ah)
Ogaanshaha spectrum soosaarka laser
Labadii sanoba mar:
Beddel suufka caagga ah ee aan shoogga lahayn
Hubi dariiqa hawada ee xiritaanka mashiinka oo dhan
7. Falanqaynta kiisaska codsiga warshadaha
Kiiska 1: Soo saarista aaladaha caafimaad ee yaryar
Caqabadaha:
0.15mm dhexroor ogaanshaha suufka
Waxay u baahan tahay 100% cilladaha eber
Xalka:
Daree qaabka xallinta aadka u sarreeya (3μm/pixel)
Deji band dulqaadka qaabka 3D
Kiiska 2: Module radar automotive
Baahiyaha gaarka ah:
Soo ogow kala-goysyada alxanka ee xidhan
U soo rar xogta nidaamka QMS
Qorshaha fulinta:
Isticmaal tignoolajiyada iskaanka leexleexda (ugu badnaan 15°)
Samee interface xogta la habeeyey