SAKI smt 3D SPI machine 3Si-LS3EX

I-SAKI 3Si-LS3EX yinkqubo yokuhlola i-solder paste yamva nje ephezulu ye-3D (SPI) esungulwe ngu-SAKI waseJapan. Yamkela iteknoloji ye-multi-spectral ye-confocal imaging kwaye yenzelwe ukuhlangabezana neemfuno zokuhlolwa kwe-solder ye-ultra-precision efana ne-01005 kunye ne-0.3mm pitch BGA. Xa kuthelekiswa nesizukulwana sangaphambili i-3Si-L2, i-LS3EX iphucule kakhulu isantya sokuhlola, ukuchaneka kunye nobukrelekrele.

Iimeko zosetyenziso oluqhelekileyo

Miniaturized electronics: smart watch motherboard, TWS headset ibhodi yesekethe

Intsimi yokuthembeka okuphezulu: imodyuli ye-ADAS yeemoto, isixhobo sokufakelwa kwezonyango iPCB

Ukupakishwa okuphezulu: Ukupakishwa kweFan-out, 2.5D/3D IC substrate

2. Iinkcukacha zobugcisa kunye nokucwangciswa kwe-hardware

Iiparamitha eziphambili zehardware

Inkqubo engaphantsi Iingcombolo zoBugcisa

Inkqubo yokubona i-7-wavelength confocal imaging (405-940nm) Cima uphazamiseko lokubonisa intsimbi

Umlinganiselo we-Z-axis wokukhanya okumhlophe i-interferometer incedise i-0.05μm isisombululo

Iqonga lentshukumo Magnetic ukumiswa drive Ukukhawulezisa 2G, ukuphinda ±1μm

Ukubona uluhlu 510×460mm uguqulelo olusemgangathweni olukhethwayo 610×510mm ubukhulu obukhulu

Iimpawu eziphambili zokusebenza

Izalathi zeParameters Iimeko zovavanyo

Ukuchaneka kobude ± 0.5μm 50μm inyathelo eliqhelekileyo

Ukuchaneka komthamo ± 2% IPC-7527 umgangatho

Ubuncinci ubungakanani bokubona 30×30μm 01005 iphedi yecandelo

Esona santya siphezulu sokuskena 1.8m/s Imowudi elula yemizobo

Umjikelo wokufumanisa <8 imizuzwana / ibhodi 300×200mm ibhodi

3. Imisebenzi engundoqo kunye nokutsha kwezobuchwepheshe

Itekhnoloji yokufumanisa utshintsho

Itekhnoloji yeSmartFocus 3.0

Imbuyekezo yogqaliselo lweDyamic ukusombulula impazamo yokulinganisa ebangelwa yi-PCB warpage

Ukulungelelaniswa kwi-0.1-1.2mm utshintsho lwebhodi yobukhulu

Injini yokuqikelela uncamathiselo ye-AI

Qikelela imilo emva kokuphinda kufakwe i-solder (linganisa inkqubo yokuguqulwa kwe-thermal)

Chonga imingcipheko enokubakho yokubopha ibhulorho/yobubuxoki kwangethuba

Imowudi ehambelanayo yenkqubo ezininzi

Uhlobo lwenkqubo Imowudi yokuFumana

Imo yesiqhelo ye-SMT yokuskena ngokukhawuleza

Ukupakishwa okuchanekileyo Imowudi yesisombululo esiphezulu (5μm inyathelo)

Imowudi yembuyekezo ye-PCB yobhedu eshinyeneyo

Umsebenzi wesoftware okrelekrele

Imodeli ye3D yexesha lokwenyani:

I-Solder incamathelise umzekelo wemodeli ye-3D

(Umfanekiso: Imephu yokuhambisa ubushushu bomthamo we-Solder)

Uyilo lwenkqubo yengxelo evaliweyo:

Itshathi

Ikhowudi

4. Iinkcukacha zokusebenza kunye namanyathelo okhuseleko

Iinkqubo zokusebenza ezisemgangathweni

Ukufudumeza phambi kokukhanyisa

Inkqubo ye-laser kufuneka ifudunyezwe imizuzu eyi-15 (yandiswe ukuya kwimizuzu engama-20 xa ubushushu be-ambient buyi-<25℃)

Ulungelelwaniso lwemihla ngemihla

Sebenzisa ibhodi yolungelelaniso ye-NIST elandelekayo ukuphumeza:

inhlwathi

def daily_calibration():

ukuba awulingani_ubude(umgangatho=50μm):

alert("ulungelelwaniso lwe-Z-axis olungaqhelekanga")

run_flatness_check()

Ukufunyanwa kwemimiselo yeparamitha

Uhlobo lwe-Solder Cola Iiparamitha ezicetyiswayo

I-SAC305 i-Wavelength indibaniselwano: blue + infrared

I-SnPb Wavelength indibaniselwano: eluhlaza + obomvu

I-conductive adhesive Imowudi ekhethekileyo ye-M7

Iimpawu eziphambili zokhuseleko

Ukhuseleko lweLaser:

Akuvunyelwe ukuvula isiciko sokukhusela xa isixhobo sisebenza (ngokuhambelana ne-IEC 60825-1 iClass 1M standard)

Iiglasi ezikhethekileyo zokukhusela i-laser kufuneka zifakwe ngexesha lokugcinwa

Ukhuseleko lombane:

Jonga ukuxhathisa komhlaba rhoqo ngeveki (kufuneka ibe <3Ω)

Emva kokungaphumeleli kwamandla ngokukhawuleza, kuyimfuneko ukuqalisa kwakhona emva kwekhefu lemizuzu emi-5

5. Ukuxilongwa kwempazamo eqhelekileyo kunye nezisombululo

Iimpazamo zeHardware

Ikhowudi yemposiso Into yempazamo Ukusetyenzwa kwamanyathelo Iimfuno zesixhobo

E701 Laser amandla attenuation 1. Coca isidibanisi ifayibha

2. Yenza ulungelelwaniso lwamandla Imitha yamandla okusebenza

I-E808 Ukungcangcazela kweqonga kunomgangatho woku-1. Jonga uxinzelelo lonyawo oludadayo

2. Ukwahlula umthombo wokungcangcazela ojikelezileyo Umhlalutyi weVibration

Ukusilela kwesoftware

Umyalezo wemposiso Umbango wengcambu

"Imodeli ye-AI yokulayisha ayiphumelelanga" Imemori yevidiyo ye-GPU eyaneleyo 1. Phucula umqhubi

2. Yenza lula indawo yokufumanisa

"Ungquzulwano kugcino lwedatha" Isalathiso seDatabase yonakele Phumeza DB_REBUILD umyalelo

Inkqubo eqhelekileyo yokusingatha ingxaki

Umphetho wencama ye-Solder ujijekile:

matlab

% isisombululo sokuSebenzisa:

ukuba uburhabaxa> 0.2μm

Lungisa isantya sokuskena = isantya sangoku × 0.8;

Ukwandisa inani lamanqaku esampuli;

isiphelo

Ukuphindaphinda umlinganiselo ombi:

Jonga iqondo lobushushu lokusingqongileyo kunye nokuguquguquka kokufuma (kufuneka kube <±1℃/h)

Hlaziya umgangatho weqonga (udinga <0.01mm/m)

X/Y ulungelelwaniso lwe-axis grating scale (ifuna i-interferometer ezinikeleyo)

Ukufunyanwa kwe-laser spectrum

Rhoqo kwiminyaka emibini:

Faka enye indawo kwiphedi yerabha eyothusayo

Jonga ukutywinwa kwendlela yomoya kuwo wonke umatshini

7. Uhlalutyo lwamatyala ezicelo zeshishini

Ityala loku-1: Ukuveliswa kwezixhobo zonyango ezincinci

Imingeni:

0.15mm ukufunyanwa kwephedi yedayamitha

Ifuna 100% iziphene zero

Isisombululo:

Yenza imo yesisombululo esiphezulu kakhulu (3μm/pixel)

Seta ibhanti yokunyamezela imilo ye-3D

Ityala le-2: Imodyuli ye-radar yeemoto

Iimfuno ezizodwa:

Khangela i-solder edibeneyo

Layisha idatha kwinkqubo yeQMS

Isicwangciso sophumezo:

Sebenzisa ubuchwepheshe bokutshekisha ukuskena (ubuninzi be-15°)

Phuhlisa ujongano lwedatha olulungiselelweyo