SAKI smt 3D SPI machine 3Si-MS2

SAKI 3Si-MS2 is a new generation of 3D solder paste inspection system (SPI) launched by SAKI. It adopts innovative multi-spectral measurement technology and is designed for quality control of solder paste printing process in high-precision electronic manufacturing. The system can realize fast and accurate three-dimensional morphology inspection of solder paste on SMT production lines, effectively preventing welding defects.

2. Core technical specifications

Project Detailed parameters

Detection technology Multi-spectral 3D imaging + laser triangulation

Measurement accuracy Z axis ±0.5μm, XY axis ±3μm

Measurement speed Maximum 1200mm/s

Measurement height range 0-500μm

Minimum detection component 008004 (0201) component

PCB size support Maximum 510×510mm (customizable)

Light source system Multi-wavelength LED combination (UV/visible light/IR)

Repeat accuracy ≤±0.3μm

Data interface SECS/GEM, OPC UA, TCP/IP

3. Outstanding features

3.1 Multi-spectral fusion technology

UV+visible light+infrared three-band imaging system

Can simultaneously detect solder paste height, area, volume and shape

Effectively identify special defects such as solder paste oxidation and contamination

3.2 Intelligent detection system

AI-assisted analysis: automatic learning of process parameters

Dynamic compensation: real-time correction of PCB warping effects

Virtual measurement: predict reflow soldering effects

3.3 Efficient production design

Dual-track parallel processing: throughput increased by 40%

Intelligent panel identification: automatic processing of irregular panels

Quick line change: program switching <15 seconds

4. Core functions

4.1 3D detection function

Solder paste thickness distribution measurement

Volume calculation (single solder joint/whole)

Shape contour analysis

Bridging risk prediction

4.2 2D auxiliary detection

Solder paste position offset

Steel mesh blockage identification

Solder paste contamination detection

Printing pull tip analysis

4.3 Data analysis

Real-time SPC process control

NG root cause analysis

Process trend prediction

Automatically generate test reports

5. Precautions for use

5.1 Environmental requirements

Temperature: 23±2℃ (best for constant temperature environment)

Humidity: 45-65%RH

Cleanliness: Class 10000 clean room recommended

Vibration: <0.1G (anti-vibration platform required)

5.2 Operation specifications

Power-on process:

System preheating for 20 minutes

Execute automatic calibration (Auto Calibration)

Verify the measurement value of the standard plate

Daily operation:

Clean the optical window every 2 hours

Back up the detection program regularly

Monitor the temperature status of the system

Safety precautions:

Do not block the heat dissipation holes

Do not use non-original cleaning agents

Laser safety level Class 2

6. Common troubleshooting

Fault code Phenomenon description Solution

E2011 Spectral sensor abnormality 1. Restart the spectral module

2. Check the connection cable

E2105 Z-axis positioning error 1. Clean the height sensor

2. Recalibrate the Z axis

E2203 Temperature exceeds the limit 1. Check the cooling system

2. Suspend cooling

E2308 Data storage failed 1. Check the hard disk status

2. Expand the storage space

E2402 Communication interruption 1. Restart the network service

2. Check the switch connection

7. Maintenance method

7.1 Daily maintenance

Every shift:

Clean the optical window (use dust-free cloth + isopropyl alcohol)

Check the conveyor belt tension

Confirm the air source pressure (if applicable)

Weekly:

Perform a comprehensive optical calibration

Back up system parameters

Clean the heat sink filter

7.2 Regular maintenance

Monthly:

Replace aging LED light sources

Lubricate linear guides

Check cable wear

Quarterly:

Deeply calibrate the measurement system

Detect ground resistance

Update system firmware

7.3 Annual maintenance

Performed by original factory engineers:

Full calibration of spectral system

Mechanical structure accuracy detection

Control system performance optimization

8. Technical advantages

Ultra-high precision: sub-micron measurement capability

Multi-spectral detection: Comprehensive evaluation of solder paste status

Intelligent prediction: AI process optimization suggestions

Efficient and stable: Industrial-grade durable design

Data fusion: Deep integration with MES/ERP

9. Application suggestions

Precision electronics: It is recommended to set the measurement resolution to 5μm

Automotive electronics: Enable strict detection mode

High-frequency boards: Increase detection sampling points

Mass production environment: It is recommended to calibrate and verify every 4 hours