SAKI smt ekyuma kya 3D SPI 3Si-MS2

SAKI 3Si-MS2 nkola empya ey’okukebera solder paste mu ngeri ya 3D (SPI) eyatongozebwa kkampuni ya SAKI. Ekwata tekinologiya omuyiiya ow’okupima ebipimo ebingi era ekoleddwa okulondoola omutindo gw’enkola y’okukuba ebitabo mu solder paste mu kukola ebyuma ebituufu. Enkola esobola okutegeera amangu era entuufu ey’okukebera enkula ya solder paste ku layini z’okufulumya SMT, okuziyiza obulungi obulema mu welding.

2. Ebikulu ebikwata ku by’ekikugu

Pulojekiti Ebipimo ebikwata ku nsonga eno mu bujjuvu

Tekinologiya w’okuzuula Okukuba ebifaananyi mu ngeri ey’enjawulo (multi-spectral 3D imaging) + okukuba ebifaananyi mu ngeri ya layisi

Obutuufu bw’okupima Z ekisiki ±0.5μm, XY ekisiki ±3μm

Sipiidi y’okupima Esinga obunene 1200mm/s

Obugulumivu bw’okupima buba 0-500μm

Ekitundu ekitono eky’okuzuula 008004 (0201) ekitundu

Obuwagizi bwa sayizi ya PCB Maximum 510×510mm (customizable)

Enkola y’ensibuko y’ekitangaala Okugatta LED ez’obuwanvu bw’amayengo amangi (UV/ekitangaala ekirabika/IR)

Ddamu obutuufu ≤±0.3μm

Enkolagana ya data SECS/GEM, OPC UA, TCP/IP

3. Ebintu eby’enjawulo

3.1 Tekinologiya wa multi-spectral fusion

Enkola y’okukuba ebifaananyi eya UV+ekitangaala ekirabika+infrared three-band

Asobola okuzuula omulundi gumu obuwanvu bwa solder paste, ekitundu, volume n'enkula

Laba bulungi obulema obw’enjawulo nga solder paste oxidation n’obucaafu

3.2 Enkola ey’amagezi ey’okuzuula

Okwekenenya okuyambibwako AI: okuyiga okw’otoma okw’ebipimo by’enkola

Okuliyirira okw’amaanyi: okutereeza mu kiseera ekituufu ebiva mu kukyusakyusa PCB

Okupima okw’omubiri: okulagula ebiva mu kusoda okuddamu okukulukuta

3.3 Enteekateeka ennungi ey’okufulumya

Dual-track parallel processing: okuyita mu kukola kweyongedde ebitundu 40%

Okuzuula ebipande mu ngeri ey’amagezi: okukola mu ngeri ey’otoma ku bipande ebitali bituufu

Okukyusa layini mu bwangu: okukyusa pulogulaamu

4. Emirimu emikulu

4.1 Omulimu gw’okuzuula mu ngeri ya 3D

Solder paste obuwanvu bw'okupima engabanya

Okubala obuzito (ekiyungo kya solder kimu/kyena) .

Okwekenenya enkula y’enkula (shape contour analysis).

Okukola omukutu gw’okuteebereza akabi

4.2 Okuzuula obuyambi mu ngeri ya 2D

Solder paste ekifo offset

Okuzuula okuzibikira kw’akatimba k’ekyuma

Okuzuula obucaafu mu solder paste

Okukuba ebitabo okusika tip okwekenneenya

4.3 Okwekenenya ebikwata ku bantu

Okufuga enkola ya SPC mu kiseera ekituufu

NG okwekenneenya ekikolo ekivaako

Okuteebereza emitendera gy’enkola

Okukola lipoota z’okugezesebwa mu ngeri ey’otoma

5. Okwegendereza mu kukozesa

5.1 Ebyetaago by’obutonde bw’ensi

Ebbugumu: 23±2°C (ekisinga obulungi ku mbeera y’ebbugumu eritakyukakyuka)

Obunnyogovu: 45-65%RH

Obuyonjo: Ekisenge ekiyonjo ekya Class 10000 kye kisemba

Okukankana: <0.1G (omusingi oguziyiza okukankana gwetaagibwa)

5.2 Ebikwata ku nkola y’emirimu

Enkola y’okussaako amasannyalaze:

Enkola preheating okumala eddakiika 20

Kola okupima okw’otoma (Auto Calibration) .

Kakasa omuwendo gw’okupima ogwa pulati eya mutindo

Okukola buli lunaku:

Yoza eddirisa ly’amaaso buli luvannyuma lwa ssaawa 2

Back up pulogulaamu y'okuzuula buli kiseera

Londoola embeera y’ebbugumu ly’enkola eno

Okwegendereza mu by’okwerinda:

Tozibira bituli bya kusaasaanya bbugumu

Tokozesa bikozesebwa mu kwoza ebitali bya mulembe

Omutendera gw’obukuumi bwa layisi Class 2

6. Okugonjoola ebizibu ebya bulijjo

Koodi y’ensobi Ennyonnyola y’ekintu Ekigonjoolwa

E2011 Obutabeera bwa bulijjo mu sensa ya spektral 1. Ddamu okutandika modulo ya spectral

2. Kebera waya y’okuyunga

E2105 Ensobi mu kuteeka mu kifo kya Z-axis 1. Yoza sensa y’obugulumivu

2. Ddamu okupima ekisiki kya Z

E2203 Ebbugumu lisukka ekkomo 1. Kebera enkola y’okunyogoza

2. Yimirizza okunyogoza

E2308 Okutereka data kulemereddwa 1. Kebera embeera ya hard disk

2. Gaziya ekifo we batereka ebintu

E2402 Okutaataaganyizibwa kw’empuliziganya 1. Ddamu okutandika empeereza y’omukutu

2. Kebera omukutu gwa switch

7. Enkola y’okuddaabiriza

7.1 Okuddaabiriza buli lunaku

Buli ssifiiti:

Okwoza eddirisa ly’amaaso (kozesa olugoye olutaliimu nfuufu + omwenge gwa isopropyl)

Kebera okusika omuguwa kw’omusipi ogutambuza

Kakasa puleesa y’ensibuko y’empewo (bwe kiba kisoboka) .

Buli wiiki:

Kola okupima okujjuvu okw’amaaso

Back up enkola parameters

Okwoza ekyuma ekisengejja ebbugumu

7.2 Okuddaabiriza buli kiseera

Buli mwezi:

Kikyuseemu ensibuko z’amataala ga LED ezikaddiye

Siiga ebiragiro ebiyitibwa linear guides

Kebera okwambala kwa waya

Buli luvannyuma lwa myezi esatu:

Kaliba nnyo enkola y’okupima

Zuula obuziyiza bw’ettaka

Okulongoosa firmware y'enkola

7.3 Okuddaabiriza buli mwaka

Ekoleddwa bayinginiya b’amakolero abaasooka:

Okupima mu bujjuvu enkola ya spectral

Okuzuula obutuufu bw’ensengekera y’ebyuma

Okufuga enkola y’emirimu okulongoosa

8. Enkizo mu by’ekikugu

Ultra-high precision: obusobozi bw’okupima sub-micron

Multi-spectral detection: Okukebera mu bujjuvu embeera ya solder paste

Okuteebereza okw’amagezi: Ebiteeso by’okulongoosa enkola ya AI

Ekola obulungi era enywevu: Dizayini ewangaala mu makolero

Okugatta amawulire: Okugatta mu buziba ne MES/ERP

9. Ebiteeso ku nkola y’okukozesa

Obuuma obutuufu: Kirungi okuteeka obulungi bw’okupima ku 5μm

Ebyuma ebikozesebwa mu mmotoka: Ssobozesa enkola ey’okuzuula enkakali

Ebipande bya frequency enkulu: Okwongera ku bifo eby’okuzuula sampuli

Embeera y’okufulumya ebintu mu bungi: Kirungi okupima n’okukakasa buli luvannyuma lwa ssaawa 4